Adhesives

Adhesive bonds non-active package surfaces.

Hysol® QMI 550SI low-CTE, silica-filled, dielectric die attach adhesive is hydrophobic and produces void-free bond lines that adhere to organic and metal surfaces. Product allows SkipPrebake(TM) and can be cured in-line using SkipCure(TM) processing 10 sec after bond line reaches 150°C. Adhesive is JEDEC Level 3 capable for 260°C reflow in tape array BGAs and may be converted to...

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Epoxy Adhesive suits high-temperature applications.
Epoxies

Epoxy Adhesive suits high-temperature applications.

Heat-resistant, one-part, solvent-free TRA-BOND 77-1S has glass-transition temperature of 200°C and withstands 1,000 hr at 100°C and 95% RH. It has working life of 3 months at 25°C and smooth consistency. Dispensed through fine-diameter needles, adhesive does not sag or tail. Cured product has lap shear strength of 2,400 psi and 94 Shore D hardness. Applications include...

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Vertical Cartoner offers speeds up to 200 cartons/min.
Sealing Equipment

Vertical Cartoner offers speeds up to 200 cartons/min.

Semi-automatic Victory 100 features stainless steel frame with single chain carton track, and 40 in. of carton loading space on each side of system. Standard carton closing is straight or reverse tuck. System includes set of sized carton pockets on 10 in. centers, 48 in. powered magazine with rotary placer, flat-belt discharge conveyor with lay-down tooling, electrically interlocked guarding, and...

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Epoxy Adhesive suits variety of applications.
Epoxies

Epoxy Adhesive suits variety of applications.

Tra-Bond 970-1N1 sag resistant epoxy adhesive develops aluminum-to-aluminum lab shear strength of 3,000 psi, can reach glass transition temperature of 83°C, and cures to 75 shore D hardness. Available in sizes and packaging to match unique application needs, product is offered in pre-mixed and frozen syringes or in Bipax for room temperature storage.

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Epoxy has 10 minute working time.
Epoxies

Epoxy has 10 minute working time.

Self-leveling, 100% solids 10 Minute(TM) Epoxy adhesive is formulated for bonding, potting, and cosmetic repairs in various OEM applications. Able to adhere to varied substrates, it is available in clear and black and has fixture time of 20 min. Functional cure is attained in 90 min. Cured product has 2,400 psi tensile shear strength, 20-25 pli peel strength, and 10 lb-ft/inÂ-² impact...

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Adhesives

Structural Acrylic Adhesive is non-sagging.

SPEEDBONDER(TM) H8000 delivers impact- and peel-resistant bonds on various surfaces including metals and composites. Product consists of 100% reactive, 2-component gel that cures at room temperature and bonds to materials with little or no surface preparation. Capable of filling gaps as large as 0.5 in., adhesive also offers environmental resistance. Product is packaged in 490 ml EPS cartridges,...

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Adhesive and Coating withstands temperatures to 2,400°F.
Adhesives

Adhesive and Coating withstands temperatures to 2,400°F.

Ceramacoat(TM) 512N high-temperature adhesive and ceramic coating system is used in assembly of ceramic, metal, and plastic electrical components and as coating of high temperature structures requiring corrosion protection. Single part, water-based, silica-filled system offers volume resistivity of 109 ohm-cm and dielectric strength of 250 V/mil at room temperature. Odorless product contains no...

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Platemounting Tapes suit flexographic printing industry.
Adhesive Tapes

Platemounting Tapes suit flexographic printing industry.

SteelMaster LT adhesive holds photopolymer plates .067 in. and thinner onto steel cylinders. Able to hold during print run, it removes with ease upon job completion. Non-building adhesive maintains initial level of holding power over time. Suited for combination printing, medium-density 52121 Softprint SteelMaster foam tape is coated with SteelMaster LT and allows for fine dot reproduction of...

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PBT Resins meet UL94-V0 specs in thin-walled components.
Resins

PBT Resins meet UL94-V0 specs in thin-walled components.

Flame-retardant Celanex® 14 Series polybutylene terephthalate resins are non-blooming, so molded parts are essentially free of surface deposits. Celanex 3314, 3214, and 3114 are 30, 15, and 7.5% glass fiber-reinforced, respectively. Celanex 2014 is unfilled, and Celanex 4014 is unfilled and toughened. Resins are suited for connectors, housings, relays, switches, motor end caps, and other...

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Underfill Material is formulated for flip chip packaging.
Epoxies

Underfill Material is formulated for flip chip packaging.

Hysol® FP4580 low stress liquid epoxy prevents cracking and delamination of chip's inner layers. It works on copper/low k flip chip laminate packages up to 50 x 50 mm with over 4,000 solder bumps. When fully cured, product forms rigid, low warp seal that dissipates stress on solder joints and extends thermal cycling performance. Hysol® FP4580 underfills devices with gaps as small as...

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