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Adhesives & Sealants
Pres-On's representatives commit to innovation, quality, and customer satisfaction, facilitating application solutions and strong business relationships within the packaging industry. BOLINGBROOK, IL — Pres-On, known for being a state-of-the-art, one-stop shop with a hands-on approach to developing application specific solutions, will be one of the more than 2,400 exhibitors at Pack Expo,... Read More
YINCAE President, Dr. Wusheng Yin, Presents: "The Future of Solder Joint Encapsulation" IPC Tech Summit 2014 in Raleigh, NCOct 28, 2014
Albany, NYÂ – Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Session on "The Future of Solder Joint Encapsulation" at the upcoming IPC Tech Summit, with the event being held from Oct 28th to 30th in Raleigh, NC. Following is the Abstract taken from the paper on "The Future of Solder Joint Encapsulation" "Solder joint encapsulant adhesives have... Read More
Heraeus Features Award-winning SOL9620 and SOL9621 Series at PV Taiwan 2014, the Taiwan International Photovoltaic ExhibitionOct 27, 2014
TAIPEI - The Heraeus Photovoltaics Business Unit will be exhibiting at this year's PV Taiwan 2014 photovoltaic exhibition from October 22nd -- 24th in Taipei, Taiwan. Heraeus, featuring their line of metallization pastes for conventional and advanced solar cell designs in Hall 1, Booth A0708. Heraeus will feature their award winning SOL9620 and SOL9621 Series of front-side metallization... Read More
With adhesives on both plate roll/sleeve and plate side, tesa SoftprintÂ® Secure double-sided foam tape series addresses challenges of plate lift and long run lengths for narrow web printers. These plate mounting tapes prevent plate lift on small repeat cylinders and sleeves while maintaining strong, secure bond. SNAP-ON bonding agent also facilitates plate mounting and demounting. Narrow web... Read More
Intended for global automakers and suppliers, 3M™ Acrylic Plus Tape Series EX4500 enables primerless application of trim components. Product, compatible with various paints without requiring adhesion promoter or other surface pre-treatment methods,Â allows adhesion to Medium Surface Energy (MSE) plastics such as acrylic, ABS, AES, ASA, PC, and PC+ABS. Tape also ensures compatibility... Read More
Summary Ultra-Temp™ 516, a high temperature zirconia and zirconium silicate filled adhesive manufactured by Aremco Products, Inc., is now used to bond zirconia ceramics used in applications to 3200 ÂºF (1760 ÂºC). Features Ultra-Temp™ 516 is a new, single part, zirconia and zirconium silicate filled, inorganic adhesive system for bonding zirconia components used in high temperature... Read More
Metal Construction Association Recognizes Valspar's Color-changing Kameleon Coatings on Award-winning Exploration Tower at Port CanaveralOct 21, 2014
MCA honors the iridescent, metal-clad Institutional Project with the 2014 Chairman's Award MinneapolisÂ – The Valspar Corporation was honored with the Metal Construction Association (MCA) 2014 Chairman's Award in the Institutional project category for its contribution to Florida's Exploration Tower at Port Canaveral's color-changing, metal-clad exterior. The Port's new,... Read More
Resistant to corrosion, chemicals, thermal shock, and electricity, Resbond™ S5H13 suits adhesive applications up to 500Â°F. Epoxy bonds heavy plastic to stainless steel; seals and insulates Bi-Polar, Electro-Cauterizers; and withstands thousands of steam sterilization cycles at 375Â°F. Adhering toÂ metals, plastics, composites, glass, and ceramics, paste cures at room temperature and... Read More
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Formulated with Encompass™ technology that combines See-Cure color change and Ultra-Red™ fluorescing technologies with LED-curing capabilities, 215-CTH-UR-SC Adhesive is suitable for bonding variety of substrates, including Nylon 12 and PEBA. Product provides secure bonds with added benefits of cure confirmation and post-cure bond-line inspection. Read More
Developed for KynarÂ®500 flouropolymer, VitrasilÂ® acrylic polyester, and powder-coated finishes, LSE SDL Series eliminates need for liquid silane adhesion promoters. System provides long-term indoor/outdoor adhesion to variety of window substrates, including easy-to-clean and self-cleaning glass. It also bonds to cellular PVC, vinyl, primed/unprimed wood, plastic, and painted aluminum muntin... Read More
Air Products to Showcase Its Epoxy Curing Agents for Adhesives and Composites Industries at CAMX 2014Oct 14, 2014
LEHIGH VALLEY, Pa. –Â For more than 30 years, Air Products (NYSE: APD) has been a leading supplier of epoxy curing agents and accelerators to the adhesives and composites industries. Air Products will feature these products at next week's CAMX, the Composites and Advanced Materials Expo, in Orlando, Fla., October 13-16. Air Products' experience with high-performance epoxy curatives... Read More
Used for bonding and assembly of catheter designsÂ featuring Nylon 12 and PEBA, MDÂ® 215-CTH-UR-SC provides secure bonds with facilitated cure confirmation and post-cure, bond-line inspection. Adhesive is blue to facilitate verification of placement in uncured state, and color transitions to colorless upon UV cure. Cured adhesive fluoresces bright red under low-intensity black light (365... Read More
Product:Â "Sticky Strip ™ on a Roll" by Clip Strip Corp. Clip Strip Corp., inventors of the globally utilized point of purchase Clip StripÂ® Merchandiser, has done it again.Â Seeing a need in certain markets for a lower cost and more versatile version of the popular "Sticky Strip™" line of merchandising strips, CSC Corp has responded with Sticky Strips ™on Rolls. Regular Sticky... Read More
Quaker to showcase PRIMECOAT™ passivates at the Galvanizers Exposition 2014 CONSHOHOCKEN, Pa.Â – Quaker Chemical Corporation (NYSE: KWR), a global leader in process chemicals, fluids, coatings, and surface treatment products in the primary metals arena, will feature PRIMECOAT™, its passivation product line at the 106(th) Galvanizers Association Meeting and Exposition in Jackson,... Read More
Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in the aerospace, electronic, electro-optic and OEM industries. This system fully passes ASTM E595 testing for NASA low outgassing and is well suited for vacuum environments. As a toughened epoxy, Supreme 12AOHT-LO resists rigorous thermal cycling and shocks over the wide service temperature... Read More
Designed for case, tray, and carton sealing, Metallocene Hot Melt Adhesives are clear in color and are not prone to charring or odor. Heat resistant products are formulated for operation across temperature range of -40 to 165Â°F. Adhesives bond to wide range of packaging substrates including coated stocks and high recycled-content board. With optimized hot tack, Metallocene hot melts can grab... Read More
CombiningÂ bond strength of structural epoxy with speed of instant adhesive, LoctiteÂ® 4090™ offers rapid, high-strength bonding to range of substrates, including metals, most plastics, and rubbers. Product offersÂ impact, moisture, and UVÂ resistance, as well as temperature resistance to 300Â°F. Available as 50 ml cartridge packaged with 5 mix nozzles, gel adhesive fixtures in 3-5... Read More
ECO-Squares™ are biodegradable hot melt pressure-sensitive adhesive (PSA) dots that provide instant adhesion and aggressive tack to help increase production and reduce adhesive failures. Able to be customized to meet specifications, these pre-engineered adhesive patches do not require heat during application. This reduces risk of burns, increases employee safety, and reduces energy demands.... Read More
Albany, NYÂ – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant. YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating... Read More
Designed to be used in modified ribbon stringer, EMS 561-147 Conductive Adhesive will snap cure and fixture ribbons in seconds at 180Â°C with enough strength to withstand module manufacturing processes until adhesive cure is completed during encapsulant lamination. Product can be dispensed by time pressure, auger, or jetting. More stress absorbing than solder, adhesive withstands rigors of... Read More