Adhesives & Sealants

Adhesives & Sealants

Thermally Conductive Epoxy cures at room temperature.

Dec 10, 2001

Two component EMCAST has viscosity of 130,000 cps, specific gravity of 1.90, and glass transition temperature of 125ºC. Its thermal conductivity is 3 W/mK, and it is not electrically conductive. 100% solids epoxy has no solvent for zero VOCs. Epoxy cures in 8 hours @ 25°C, 1 hour @ 65°C, and 15 minutes @ 100°C. It is available as pre-mixed and frozen syringes or in two component kits.... Read More

Adhesives & Sealants

Machinery Adhesives lock and seal nuts and bolts.

Nov 28, 2001

Superlock adhesives provide positive locking and sealing on both active and inactive surfaces. Screw Lock Grade 2222 low-strength threadlocker is for spiral screws less than 1/4 in. diameter. Medium-strength Grade 2242 works on nuts, bolts, and screws with diameters up to 3/4 in. Grade 2262 high-strength formula controls torque/tension and clamp load on larger bolts and nuts in applications... Read More

Adhesives & Sealants

Epoxy Adhesive has low vapor pressure.

Nov 28, 2001

Two-part Tra-Bond 2116 thixotropic adhesive can be used in electronic and industrial applications where high-fill, non-sag adhesive is needed. It bonds well to many substrates including metals, glass, ceramics, wood, and plastics. Adhesive cures at room temperature, is electrical insulator, and is NASA outgassing approved. It resists chemicals and weather. Read More

Adhesives & Sealants

Graphite Adhesive works at temperatures to 5400° F.

Nov 28, 2001

Resbond 931 cures at 250°F to form 99% pure graphite bonds that have bond strengths in excess of 2500 psi. Bonds are electrically conductive and resist reducing atmospheres, most chemicals, and solvents. Applications include repairing cracked or broken graphite trays, fixtures, and dies; filling and rebuilding crevices, cracks, and worn areas; and bonding graphite cloths, felts, and boards. It... Read More

Adhesives & Sealants

UV Adhesive bonds fiber optics.

Nov 21, 2001

TRA-BOND F 175 clear, low viscosity adhesive bonds metals, ceramics, and most rigid polymers. Cure time of a few seconds upon exposure to ultraviolet light makes it suitable for fiber optic terminations where fast cure is required. It produces very little shrinkage upon cure, so stress is minimal. Adhesive also works well in high humidity environments or in applications that require thermal... Read More

Adhesives & Sealants

Moisture Resistant Encapsulant has smooth consistency.

Nov 21, 2001

Tra-Bond 933-1.5 electrically insulating epoxy encapsulant is formulated to provide smooth crowns over devices of wire bonds. Encapsulant provides protection from thermal and mechanical shock. Compound is stable at room temperature for up to three months, but is best kept stored at -40°C or colder, since filler may settle. Read More

Adhesives & Sealants

Adhesives are designed for wireless device assembly.

Nov 17, 2001

Pressure-sensitive adhesives offer electrically conductive, EMI shielding, electronically clean and optically clear tapes. ARclad 8314 and 8901 are 8 mil, double-sided, high-tack acrylic tapes for foams, rubbers and low surface energy materials. ARclad 7992 is a 5 mil, double-sided acrylic tape for wood, wallboard, ceramic tile, glass, painted surfaces, metals and plastics. Tapes conform to... Read More

Adhesives & Sealants

Liquid Epoxy Encapsulant provides fast capillary flow.

Nov 16, 2001

Hysol® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 260°C requirements. This high-purity, low-stress liquid epoxy encapsulant is designed for use in fine pitch applications having... Read More

Adhesives & Sealants

Splicing Tapes link siliconized substrate.

Nov 15, 2001

Silicone, double-faced ARclad 9024 and 9025 perform flying splices, manual splices, core starting and roll finishing splicing. Both are suitable for use with silicone coaters, laminators/coaters and other converting operations. Both resist high-temperatures. Highly visible red color allows operators to clearly identify splices during applications. Tapes provide quick tack and consistent caliper,... Read More

Adhesives & Sealants

Repair Mortar fixes holes in concrete.

Nov 13, 2001

General purpose Sealtight Meadow-Crete GPS makes patches l/4 in. and deeper for horizontal, vertical and overhead repairs and resurfacing of concrete. Mortar has creamy consistency, can be applied using trowel or wet spray process and is easily finished. It is polymer modified, shrinkage compensated, fiber reinforced, micro silica enhanced, and has corrosion inhibitors. Read More

Adhesives & Sealants, Safety & Security Equipment

Foam Tapes are designed for use in high temperatures.

Nov 09, 2001

Duofoam® VJ Series polyethylene foam tapes are double coated with pressure sensitive acrylic adhesive providing excellent long-term aging, resistance to environmental extremes, and performance over a range of operating temperatures. Foam does not absorb water and provides good thermal insulation properties. Tapes are available in black and white, and are conformable to irregular surfaces. Read More

Adhesives & Sealants

Epoxy Adhesive cures at low temperatures.

Nov 08, 2001

TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60° C. Epoxy contains no volatile solvents and features excellent temperature resistance, hardness and strength. Read More

Adhesives & Sealants

Epoxy provides clear lamination.

Nov 08, 2001

TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics. Read More

Adhesives & Sealants

Splicing Tape is designed for low-energy surface substrates.

Nov 08, 2001

ARcLad® 9030 orange double-faced tape features quick tack properties for splicing low-energy substrates such as polyethylenes, high-slip films, and other difficult-to-adhere-to surface substrates. Arclad® 9030 is tearable and may be used for zero speed; overlap splicing, core starting and roll finishing splicing applications. Read More

Adhesives & Sealants

Conductive Adhesive is silver-filled.

Nov 08, 2001

QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150°C. This product can perform in lead-free, 260°C reflow applications. Hydrophobic, and stable at high temperatures, QMI 526 delivers void-free bond lines with excellent adhesive strength on organic and metal surfaces. Its adhesion mechanism compensates for fluorine and... Read More

Adhesives & Sealants

Foam Glazing & Muntin Mounting Tapes are pressure sensitive.

Nov 08, 2001

ARclad® pressure-sensitive foam glazing tapes offer cold flex, good sealing characteristics, and cyclic shock resistance. They require no cure time, apply and adhere without oozing, and require no cleanup. ARclad® 2000 glazing tapes offer high shear and internal strength. ARclad® 8231 double-faced glazing tape delivers permanent anchorage to foam. ARclad® pressure-sensitive foam... Read More

Adhesives & Sealants

Epoxy features built-in cure indicator.

Nov 08, 2001

CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80° C and moisture resistance, chip is assured of stable... Read More

Adhesives & Sealants

Universal Epoxy bonds well with glass ceramic.

Nov 01, 2001

AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100°C, and produces a glass transition temperature of over 120°C. It bonds well to glass ceramic, metals and most plastics. Heat-cured product has 90 minute working time. Designed for terminating multimode and multifiber... Read More