Victrex Polymer Solutions Reinforces Its Focus on Composites

WEST CONSHOHOCKEN, PA, USA - Victrex Polymer Solutions has strengthened its composites business focus and has established a worldwide task force to offer an array of technical resources to assist engineers both at the processor and end-user level in order to address specific requirements within the composite area. The pressure to reduce weight, enhance reliability and durability, reduce...

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Kraton Announces Plans to Showcase Latest Advancements in Elastic Nonwovens, NEXAR(TM) Polymers for Performance Fabrics, and C5 Resin Alternatives for Adhesives at INDEX 11 GENEVA PALEXPO, April 12-15, 2011, Geneva, Switzerland

HOUSTON, March 23, 2011 -- Kraton Performance Polymers, Inc. (NYSE: KRA), a leading global producer of styrenic block copolymers or SBCs, announces plans to showcase and discuss its latest innovations in elastic nonwovens, NEXAR(TM) Polymers, and C5 Resin alternatives for adhesives at INDEX 11 in the GENEVA PALEXPO Exhibition and Conference Centre, Geneva, Switzerland. INDEX 11, which is...

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Compact Tray Sealer is intended for medical device market.

Semi-automatic T260, available with validation packages compliant with ISO 11607 and FDA 21 CFR Part 11, is designed for cleanroom compatibility and has enclosed cooling water circuit that permits tooling changes without water disconnection. While IPC 06 control system for electronic validation of parameters is standard, optional RFID technology facilitates tracking of machine operator control...

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Bosch at Interpack 2011 Innovations Offer Maximized Quality and Efficiency for Pharmaceutical Lines

o High flexibility and safety for filling of liquid pharmaceuticals o Bosch expands its portfolio in syringe processing and pure water generation o Consulting services help achieve high Overall Equipment Effectiveness Bosch Packaging Technology is presenting two recent developments in its filling and sealing machines for liquid pharmaceuticals at Interpack 2011 in Düsseldorf. The technologies...

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Conductive Die Attach Films suit leadframe applications.

Conductive Die Attach Films suit leadframe applications.

Ablestik C100 series conductive die attach films include Ablestik C130 formulation with 30 micron thickness and Ablestik C115 with 15 micron thickness. Suitable for use with die sizes ranging from 1 x 1 mm up to 6 x 6 mm for package types including QFNs and QFPs, films provide optimal wetting ability with lower bonding temperature for stable adhesion strength. This enables adhesion against...

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MEDPort's Private Label Line of Fit & Fresh(TM) Containers Gets a Healthy Boost in Shelf Appeal with Milliken Millad® NX(TM) 8000 Clarifier

SPARTANBURG, S.C. - MEDPort LLC, manufacturer of the Fit & Fresh(TM) family of products for healthy eating on the go, upgraded to polypropylene (PP) clarified with the advanced Millad-® NX(TM) 8000 clarifying agent from Milliken & Company. MEDPort made the move to Millad NX 8000 to create a private label line of Fit & Fresh containers offering exceptional clarity, brightness and overall shelf...

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Void-Fill System delivers crumpled paper from rollstock.

Void-Fill System delivers crumpled paper from rollstock.

Designed to deliver crumpled paper from rollstock at speeds up to 150 in./sec, GeoSpeed-® Quantum(TM) features floating-head design, which enables roll loading in seconds. Portable system, designed to avoid paper jams, can use standard kraft grade paper, which is made from percentage of recycled content, or GeoSpeed-® Renew(TM) 100% recycled paper option, which is less abrasive than standard...

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PEEK Grade suits wire and cable insulation applications.

Consisting of medium-viscosity resin, KetaSpire-® KT-851 NT is for use in melt extrusion-based wire and cable insulation layers, as well as monofilaments, multi-filament fibers, ultra-thin tubing, and films. Semi-crystalline material allows for production of articles that are low in gel content and other particulate contamination. KT-851 NT incorporates trace level of lubricant dusted on pellets...

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Silicone Putty fills gaps in electronic assemblies.

With thermal conductivity of 3.5 W/mK, Tputty(TM) 506 series is specifically formulated to fill large and uneven gaps in high-wattage electronic assemblies. Soft, single-part, silicone putty does note require any cure, transfers little to no pressure between interfaces, and is non-abrasive. Conformable and reworkable, filler is colored for automatic detection systems and has viscosity that...

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DuPont Building Innovations Announces Sole-Source Exclusive Agreement with Beazer Homes

eSMART by Beazer Homes® to Use DuPont(TM) Tyvek® Weatherization Systems on Every Home WILMINGTON, Del., - DuPont Building Innovations (DuPont) is proud to announce that Beazer Homes, one of the top 10 homebuilders in the United States, has signed a sole-source exclusive agreement to use DuPont(TM) Tyvek® Weatherization Systems on every home. This deal includes the utilization of the full...

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Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions
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Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions

Triad Magnetics is an established leader in power supply innovation, offering product lines that span a wide range of diverse industries and applications. Adding to their long list of successful product launches, Triad announces the release of the new cutting-edge JSU Series of power supplies. To learn about all of its advantages and advanced features, see our video.

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