Adhesives

Conductive Adhesive suits photovoltaic applications.

Providing optimized conductivity on molybdenum substrates, DB-1541-S3 Stringer Attach Adhesive is suited for use in thick-film, organic, and thinned silicon solar modules. Product reduces silver content while maintaining optimized rheology for dispensing, damp heat resistance, and conductivity stability on tin, tin-silver, and silver-plated ribbons. Adhesive features rubber-like flexibility and...

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Bonders

Wafer Bonding Machine produces 3-D ICs at room temperature.

Utilizing Fast Atom Beam gun to irradiate atoms on surface of bonding material, Wafer Bonding Machine enables 3-D integration of LSI circuits on 8 in. wafers at room temperature. FAB gun removes oxide film on surface of bonding metal material that normally impedes bonding. Cassette, capable of housing twenty 8 in. wafers, can perform wafer conveying and alignment for bonding automatically. By...

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Fiber

SABIC Innovative Plastics' Ultem* PEI Fiber Debuts in Japan Wool Textile Company's New Work Wear Line, Weaving Together Comfort, Protection

PITTSFIELD, Mass. - SABIC Innovative Plastics today announced that its versatile, high-performance Ultem polyetherimide (PEI) fiber has found an important new application in high-end work wear and protective clothing. Japan Wool Textile Company, a division of NIKKE Group, is now blending Ultem fiber with wool and other materials to produce yarn, fabrics and garments that offer a unique...

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Epoxies

Valtech Corporation Displays Full Line of Consumable Products Used in the PV Industry

POTTSTOWN, Pa. - Valtech Corporation, a leading global manufacturer of various consumable products used in the photovoltaic industry will be displaying their full line of high-performance epoxy adhesives, custom molded polymers, and formulated cleaning detergents at Intersolar North America, July 12-14, 2011, Moscone Center, San Francisco (Booth 9115). Valtech's epoxy adhesive systems exceed the...

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Wearing Compound protects against impact and abrasion.
Epoxies

Wearing Compound protects against impact and abrasion.

DFense Blok(TM) alumina ceramic bead-filled epoxy compound, when used with surface wetting agent, increases drop impact strength over 1 in. ceramic tile as tested using 85 lb weight with 0.25 in.Â-² striking surface. It also withstood abrasion testing via No. 14 silicon carbide blasted at 40 psi and 45° angle. With working time of 25 min, non-sagging compound can be applied by trowel...

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Adhesives for Quartz Oscillators offer low stress, thermal stability.
Adhesives

Adhesives for Quartz Oscillators offer low stress, thermal stability.

Electrically conductive and electrically insulating adhesives for quartz oscillator circuits are suited for bonding leads onto quartz crystals and surface mount lid attachment. Electrically condictive products include flexible, medium- and low-viscosity solutions that can be screen printed or machine dispensed. Lid attachment products are optimized for thermal conductivity, thermal cycling, and...

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Adhesives

Henkel Demonstrates Comprehensive Line of Products for Front - and Back-End Photovoltaic Assembly

Adhesives, Sealants and Cleaners Supplier Exhibits at Semicon West and Intersolar North America ROCKY HILL, Conn. - At Semicon West and Intersolar North America, July 12 through 14, at the Moscone Center in San Francisco, Henkel Corporation will demonstrate its broad capabilities for photovoltaic manufacturing to exhibitors interested in both front- and back-end production processes. Henkel's two...

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Resins

Conductive Hybrid Plastic is lightweight, cuts component weight.

Composed of polyamide 66 and nickel-plated carbon fiber, ElectriPlast(TM)-CF66 is engineered to meet electro-magnetic shielding, thermal requirements, and mechanical properties for automotive, marine, and aerospace applications. Non-corrosive electrically conductive, resin-based composite can be molded into any shape or size associated with plastics, rubbers, and other polymers. Material also...

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Semiconductor Processing Equipment

Wafer Bonding System offers in-line metrology module.

Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing...

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Resins

SABIC Innovative Plastics' Tough Ultem* HU1004 Resin Validated as Top Material of Choice for Multiple Sterilization Capabilities vs. PPSU

PITTSFIELD, Mass. - SABIC Innovative Plastics today announced third-party test results that validate the multiple sterilization capabilities of its remarkably tough Ultem* HU1004 polyetherimide (PEI) resin. This high-performance resin-previously utilized for other techniques and now tested for use with the STERRAD® NX® low-temperature hydrogen peroxide gas plasma sterilization - gives...

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