Link-Tech's New PolyBrass Ball Valve Uses Acudel® Modified PPSU in Industry's First Modular Ball Valve
Resins

Link-Tech's New PolyBrass Ball Valve Uses Acudel® Modified PPSU in Industry's First Modular Ball Valve

Acudel Resin Delivers Resistance to Hot Chlorinated Water and Tight Tolerance Molding to Ball Valve Designed for Lead-Free Potable Water Systems ALPHARETTA, Ga. - Link-Tech Co., Ltd., Tianjin, China, a component manufacturer for plumbing and heating systems, has developed the industry's first modular ball valve which features several thermoplastic components including the ball, the ball valve...

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Sealing Equipment

ProSweets 2012

Bosch to Showcase First Single-Wrap Die-Fold Package with Hermetic Seals Precise folds achieved for premium package look Utmost assurance of product safety due to air tight seal Machine designed for gentle product handling and heat minimization Bosch Packaging Technology will present its first single-wrap die-fold package with hermetic seals at ProSweets 2012 in Cologne. Now, chocolate...

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Elastomer Technology provides grip even in wet conditions.
Rubber

Elastomer Technology provides grip even in wet conditions.

Use of Wet Grip elastomer technology, offered under THERMOLAST® W trade name, increases coefficient of friction (COF) in TPE materials for greater degree of grip in dry and wet applications without any negative impact on physical and rheological performance. Wet Grip compounds, which are available in 25-60 Shore A hardness and meet FDA approvals, also enhance surface smoothness, sealing,...

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Automated Wafer Bonding Machine uses room temperature production.
Slicers

Automated Wafer Bonding Machine uses room temperature production.

Eliminating heat stress and strain in bonding process, Bond Meister MWB-12-ST produces 3D integrated LSI (large-scale integration) circuits at room temperature. Fast atom beam (FAB) gun irradiates atoms for activating material surface to bond, and up to 20 ton weight loading is applicable for bonding. In addition to being able to perform wafer transfer and alignment, machine accommodates setting...

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Bonders

Wafer Bonding Machine produces 3D LSI circuits at room temp.

Utilizing fast atom beam gun to irradiate atoms for activating material surface, Bond Meister MWB-12-ST can provide continuous bonding of up to five 12 in. wafers and perform wafer transfer and alignment for automatic bonding. FAB gun effectively removes oxide film on surface of bonding metal material that normally impedes bonding. By eliminating heating process, room-temperature bonding frees...

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Sealants

Universal Sealing Material meets food/beverage processing needs.

To meet sealing challenges surrounding food and beverage processing, Fluoroprene® XP 40 withstands both chemically aggressive cleaning agents and sterilizing steam as well as high-fat concentrations and flavoring agents found in processing applications. This universal sealing material is resistant to temperatures from -15 to +200°C and suited for facilities that manufacture and...

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Custom Formulated Adhesives serve medical, surgical applications.
Adhesives

Custom Formulated Adhesives serve medical, surgical applications.

Available in custom formulations, adhesives for medical and surgical applications in wound care, ostomy appliances, surgical drapes, and medical diagnostic devices exhibit stretchability, conformability, breathability, absorbency, porosity, and durability. These hydrocolloid, hydrophilic, and conductive adhesives are gentler on skin without sacrificing long lasting bonds and can be imbued with...

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Advances in Junction Box Mounting and Sealing Systems
Adhesive Tapes

Advances in Junction Box Mounting and Sealing Systems

Kennesaw, GA - Fabrico, the leader in design and manufacturing services for flexible materials and bonding, joining, and sealing solutions, announces new liquid and tape solutions for solar panel junction box mounting and sealing. Assembly cost and connection reliability are critical considerations in solar manufacturing. New advances in junction box mounting and sealing technology can help solar...

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Electrically Conductive Adhesive is used with tin-terminated components.
Adhesives

Electrically Conductive Adhesive is used with tin-terminated components.

ABLESTIK ICP-3535M1 is 1-component, pre-mixed electrically conductive adhesive (ECA) that provides low and stable contact resistance when used with 100% tin-terminated components, avoiding need for noble metals such as palladium silver, silver and gold. ECA provide low temperature processability, streamlined manufacturing techniques, low stress assemblies, and regulatory-compliant lead-free...

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Epoxy Adhesive/Sealant meets USP Class VI requirements.
Epoxies

Epoxy Adhesive/Sealant meets USP Class VI requirements.

Suited for medical applications, silver-filled EP3HTSMED is 100% reactive with tensile shear strength exceeding 1,000 psi and volume resistivity less than 0.001 Wcm. Thixotropic paste requires no mixing and needs only contact pressure during heat cure of 20-40 min at 300°F or 40-90 min at 250°F. Serviceable over temperature range of -60 to 400°F, electrically conductive product...

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