New HI-THANE Ink Binders and Adhesives are Suitable in Flexible Packaging Industry
Adhesives

New HI-THANE Ink Binders and Adhesives are Suitable in Flexible Packaging Industry

Songwon offers HI-THANE™ A-9135T and A-9107T ink binders and HI-THANE™ A-7332 adhesive. The ink binders exhibit improved anti-blocking properties and high heat resistance. A-9135T and A-9107T are suitable for applications such as retort pouches, gravure and flexographic printing inks. A-7332 Solvent-free polyurethane laminating adhesive features enhanced wetting properties that reduces...

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New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Epoxies

New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates

Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...

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New Metal-Resin Bonding Technology Uses Metal Insert Molding
Resins

New Metal-Resin Bonding Technology Uses Metal Insert Molding

Poltplstic’s Quick-10® Metal-Resin Bonding Technology is used in bonding metal parts and resins by a molten resin applying via injection molding to metal parts that have gone surface treatment. The technology is suitable for mobile device parts such as mobile phones, tablets and digital cameras. Resin composites exhibits properties of metals and engineering plastics. Quick-10 utilizes quick...

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How to Choose the Right Adhesive Tape for Your Application
Sponsored

How to Choose the Right Adhesive Tape for Your Application

With a considerable number of adhesive materials, applications and methods, there are many options to consider when choosing an adhesive tape. As NADCO® is a leading manufacturer of custom tapes and labels; we took our years of experience to create this handy selection guide on choosing the right adhesive tape for your application.

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New Electrically Conductive Adhesives Increase Module Performance
Adhesives

New Electrically Conductive Adhesives Increase Module Performance

Henkel’s LOCTITE® ABLESTIK® ICP 8000 series Electrically Conductive Adhesives are designed for accommodating assembly processes such as shingled solar modules and cell interconnect ribbon bonding. The products offer compatibility with wafer thickness of less than 160 µm and printing and dispensing speeds of more than 200 mm per second. The adhesives increase in-line inspection and can cures...

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One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Epoxies

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...

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New TS-72 Sealing/Lidding Machines Come with Quick Changeover Functionality
Sealing Equipment

New TS-72 Sealing/Lidding Machines Come with Quick Changeover Functionality

Ossid’s TS-72 Sealing/Lidding Machines are used for packaging beef, chicken, pork and seafoods in trays, cups, rounds and vacuum packs. The machine provides high yielding output with an operating cycle of up to 15 per minute. Units are available for ambient, modified atmosphere packaging (MAP) and MAP with vacuum applications. TS-72 machines allow production of range of stock keeping units on...

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New LT Compounds Can be Used as Lightweight Alternatives
Compounds

New LT Compounds Can be Used as Lightweight Alternatives

Light and Tough Compounds come with a weight of 5-10% less than typical filled compounds. The compounds are used to provide weight reductions in parts molded with glass fiber reinforcement and the density offered by the compounds is independent of wall thickness. Product is suitable for handheld, battery-operated tools, sporting goods, handheld appliances and recreational vehicle.

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Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Epoxies

Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications

Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...

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