MIDDLEFIELD, Conn. – Zygo Corporation (Nasdaq:ZIGO), a worldwide supplier of optical metrology instruments and high precision optical systems, today announced that its Semiconductor Advanced Packaging Systems group has been awarded an order valued in excess of $3 million from a major Asian IC substrate manufacturer to deliver multiple state-of-the-art High Volume Manufacturing (HVM) 3D/2D metrology systems for production process monitoring and product yield enhancement. These latest-generation metrology systems will be assembled and shipped from Zygo's Tainan, Taiwan plant and operations center.
"This order is the culmination of a multi-year product development collaboration between our Semiconductor Advanced Packaging Systems Group engineering and applications teams and our customer. Our solution combines Zygo's core metrology expertize with a HVM-capable platform to provide true in-line process monitoring at industry-leading cost of ownership," stated Tony Allan, the Company's Chief Operating Officer. "This order further establishes Zygo as a leading supplier of process monitoring and yield enhancement tools for the high-growth Advanced Packaging market."
Zygo Corporation is a worldwide supplier of optical metrology instruments, precision optics, and electro-optical design and manufacturing services serving customers in the semiconductor capital equipment, bio-medical, scientific and industrial markets.
John P. Jordan
Vice President, Chief Financial Officer & Treasurer