ZIF Socket is suited for 0.4 mm pitch BGA.

Press Release Summary:

Accommodating 12 mm BGA body size IC packages with 28 x 28 array and 515 balls, Model SG-BGA-7096 can operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss, and can dissipate up to 100 W with custom heat sink. Socket requires only space on board for 2 mounting screw areas and 2.5 mm clearance around chip. Unit features typical contact resistance of 23 mW per pin, 10.15 nH pin inductance, and 0.10 pF capacitance. It operates over temperature range of -35 to +100°C.

Original Press Release:

High Performance, 10 GHz Socket Technology for 0.4mm Pitch BGA

ZIF Socket your 0.4mm pitch Shinko BGA package without significant performance loss

BURNSVILLE, MN - September, 2007 - Ironwood Electronics has recently introduced the new high performance BGA ZIF socket for 0.4mm pitch BGA. The SG-BGA-7096 socket is designed for a Shinko 12mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin. The socket requires only space on the board for the two mounting screw areas and 2.5mm clearance around the chip so discrete components can be placed near the IC.

The SG-BGA-7096 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +100 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates 12mm BGA body size IC packages with 28X28 array and 515 balls. Simply attach the socket to the PCB with two screws, drop in chip, attach lid, and tighten compression screw.

Pricing for the SG-BGA-7096 is $494 at qty 1 with reduced pricing available depending on quantity required.

Ranjit Patil
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404 - 0204
Fax: 952-229-8201

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