Yazaki Displays Latest Technology at SAE 2007 World Congress
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CANTON, Mich., April 16 - Yazaki Corporation (Yazaki), a leading supplier of vehicle power and data solutions to the automotive industry, will display their latest technology at SAE 2007 World Congress this week at Cobo Conference and Exhibition Center in downtown Detroit, April 16-19. The display, themed "Yazaki Connects You with Innovation," highlights a diverse portfolio of products and technology.
"We are excited about the show this year, and looking forward to demonstrating our latest technological advancements and capabilities," said Doug Burcicki, senior manager, Marketing and Product Management. "SAE World Congress is always a fantastic show that brings suppliers, customers and consumers together under one roof."
Yazaki's booth (#1566) will showcase digital power modules, connectors, instrumentation, and their latest hybrid electric vehicle (HEV) technology. Two of the main attractions at the booth will be a full size wire harness and HEV optimized buggy.
The wire harness, affixed to a display wall, will demonstrate how power is distributed throughout a vehicle and why proper connectivity is important for increased vehicle reliability. The HEV buggy features EEHXBSX wire, a high temperature wire. EEHXBSX is newly developed by Yazaki and is being used in Asian, European, and North American applications.
Also on display will be HEV wire with integrated shielding, which reduces weight and the number of components in the vehicle. These benefits result in cost reduction and less complex shielding structures. Plug-in type HEV connectors will be featured in the booth as well. As opposed to an eyelet-type HEV Motor to Inverter connection system, which will also be on display, the plug-in system makes the vehicle assembly process much easier.
SAE Panel Discussion
Yazaki Chief Engineer of R&D for Yazaki North America Richard Burns is participating in the Electronics Open Architectures panel discussion, Monday, April 16, at 2:30 p.m. The discussion, hosted by Jeff Owens, president of Delphi Electronics and Safety division, focuses on the performance requirements an open architecture needs to function effectively in the automotive environment. The experts will outline how open architecture impacts each sub-system and the challenges that are created. Burns will speak specifically of the impact on connectivity.
SAE Technology Paper Presentation
Fawaz Baltaji, product line manager, and Eric Olsen, senior manager Yazaki North America, Inc. will present their research paper titled, "Digital Connectivity Trends for In-Vehicle Infotainment Systems," during the Taste of Convergence 2006 technical paper session on Thursday, April 19, at 9:30 a.m. in room W2-64. Baltaji and Olsen were asked to present their paper at SAE after being chosen as one of the top five papers presented at Convergence last October. The paper discusses the evolution of in-vehicle infotainment systems over the last decade, and the growth in the industry.
About Yazaki
Yazaki Corporation is a global leader in the research, development and delivery of vehicle power and data solutions, as well as advanced electronic technologies for vehicle applications. Yazaki produces electrical distribution systems, fiber optics, instrumentation, solid-state power centers, connection systems and electronics. Worldwide, the company employs over 160,000 people in 38 countries, 1,500 of whom are based in the company's North American headquarters and research center campus in Canton, Michigan. For more information on Yazaki, log onto www.yazaki-na.com.
Source: Yazaki Corporation
CONTACT:Kirsten Ussery, Yazaki North America, +1-734-983-1104;
Misty Matthews, Franco Public Relations Group, +1-313-567-5044
Web site: www.yazaki-na.com/
