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Original Press Release:
GE Fanuc Intelligent Platforms Expands Telecommunications Capabilities
ARTM-200FG Intelligent AdvancedTCA Rear Transition Module (ARTM) and ARTM Customization Services Introduced
06/16/2008
o Customization services for pin-outs and functionality
o Dual 4 Gbits/second Fibre Channel interfaces
o Six Gigabit Ethernet ports
LAS VEGAS, NV June 16, 2008 At NXTcomm (June 16 - 19, Las Vegas Convention Center) GE Fanuc Intelligent Platforms (booth SL5310) announced important additions to its growing line of telecommunications products and services.
The company's first intelligent AdvancedTCA Rear Transition Module (ARTM) provides a substantial expansion to the I/O capabilities of the AdvancedTCA (ATCA) processor blades that are extensively used in leading-edge telecommunications systems, enabling customers to develop more powerful solutions. Additionally, the company announced the availability of customization services that will allow customers to obtain ARTM solutions specifically adapted for their unique applications, providing highly valued flexibility.
GE Fanuc worked with one of the leading vendors of carrier grade servers, Sun Microsystems, to implement this ARTM to work with their CT900 ATCA system. While the standard version of the ARTM-200FG adheres to the Sun Netra Zone 3 signaling specification, GE Fanuc also offers customization services for customers requiring alternative Zone 3 blade pinouts and application-specific functionality. GE Fanuc Intelligent Platforms offers the widest portfolio of AdvancedMCs in the industry, and these can be leveraged to create ARTMs that meet specific application requirements.
"Sun partnered with GE Fanuc to define the common Zone 3 specification because of their leadership as an I/O solution provider and we are thrilled with the results," said Mark Butler , Netra Systems Product Line Director, Sun Microsystems. "The GE Fanuc ARTM-200FG solution will work over our entire multi-core 10G ATCA blade set including Sun's SPARC Multi-core and Multi-Threaded T2, Quad Core XEON, and AMD Multi Core based blades. This work is crucial because it promotes I/O reusability, a very important customer requirement, and further accelerates ATCA systems integration."
The ARTM-200FG intelligent ARTM expands the I/O capabilities of ATCA processor blades by adding Fibre Channel Host Bus Adapter and Gigabit Ethernet network interface card functionality. It provides dual 4 Gbits/second Fibre Channel interfaces to allow for fast communication with storage arrays; six Gigabit Ethernet ports, allowing for balanced network throughput; and a Gigabit Ethernet management port for remote supervision and attachment to management systems. It is designed for NEBS compliance.
"The ARTM-200FG is yet another example of our commitment to providing communications carriers and network equipment providers with powerful, flexible solutions for expanding the I/O capacity of their ATCA processor blades," said Lisa East, I/O Product Manager at GE Fanuc Intelligent Platforms. "It also exemplifies our ability to respond to individual customer requirements by leveraging our AdvancedMC technology in order to create unique ARTM solutions that precisely match a customer's operating environment and requirements."
An IPMI v2.0-compliant ARTM Module Management Controller (MMC) subsystem initializes board level parameters, monitors board voltage and temperature conditions, maintains system status, and manages hot swap operation. A microcontroller is used as the IPMI intelligence and connects to the AMC management bus. The ARTM-200FG is hot swap capable and field replaceable in accordance with the PICMG AMC.0 specification. Firmware supports the HPM.1 IPMI controller firmware upgrade specification.
Space for mezzanine card sites is very limited on next generation ATCA processor blades; consequently, simply adding I/O functionality via AdvancedMCs may not be an option. Intelligent ARTMs offer a powerful, flexible solution. Using the Zone 3 connector to provide expanded I/O capacity through the rear of the ATCA blade, system designers can tailor the I/O capabilities of their processor blades to more specifically match the application to be supported. They can configure I/O cabling once, and swap processor blades in and out independently.
About GE Fanuc Intelligent Platforms
GE Fanuc Intelligent Platforms, a joint venture between General Electric (NYSE: GE) and FANUC LTD of Japan, is a high-performance technology company and a global provider of hardware, software, services, expertise and experience in automation and embedded computing, with products employed in virtually every industry, including manufacturing automation, defense, automotive, telecommunications, healthcare and aerospace. GE Fanuc Intelligent Platforms is a worldwide company headquartered in Charlottesville, VA, and is part of GE Enterprise Solutions. GE Fanuc Intelligent Platforms provides a unique foundation of agile, advanced and ultra-reliable technology that customers can trust to ensure their long-term success.
For more information, visit www.gefanuc.com
Press Contacts
Ian McMurray
+44 1327 322821
ian.mcmurray@gefanuc.com
European Contact:
Anthony O'Sullivan
+49 8215034-171
tony.osullivan@gefanuc.com
APO Contact:
Howard Zhou
+86 755 83475668
hzhou@sbs.com
