X-ray Inspection System suits medical device industry.
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Press Release Summary:
MicroXCT(TM) defect detection system scans packages in 3D at full resolution using non-destructive tomography to view structure. Multiple resolution modes allow user to switch from navigation at 30 µm to high-res defect localization and characterization at 1 µm. Tomography features virtual cross-section capability that images and constructs 3D volumetric dataset with up to 1,000 cross-sectional slices in 15 min. System is also targeted for semiconductor packaging industry.
Original Press Release:
FEINFOCUS and Xradia Introduce Advanced Micro-CT X-ray Inspection
STAMFORD, CONNECTICUT - FEINFOCUS, a COMET business unit and leading manufacturer of high-resolution microfocus X-ray inspection systems, and Xradia, a developer of ultra high-resolution X-ray imaging systems for 3D tomography, announce a new advanced 3D X-ray inspection technology for the Semiconductor Packaging and Medical Device industries.
The microXCT(TM) defect detection system utilizes non-destructive 3D tomography to view the complete structure of advanced packages. Unlike conventional X-ray imaging systems that lose resolution during tomography, the microXCT(TM) scans packages in 3D at full resolution. Multiple resolution modes allow the user to easily switch from navigation at 30µm to high-resolution defect localization and characterization at 1 µm. The automated 3D tomography available on the microXCT(TM) features virtual cross-section capability thus eliminating the need for costly and time-consuming sample preparation. The system typically images and constructs a high-resolution 3D Volumetric dataset with up to 1000 cross-sectional slices in fifteen minutes, The compact design of the microXCT(TM) makes the system ideal for any manufacturing environment. COMET now offers the microXCT in addition to their line of award-winning FEINFOCUS microfocus X-ray inspection systems.
"We are delighted to announce our association with Xradia," commented Jon Dupree, FEINFOCUS Business Unit Manager for COMET North America. "With Moore's Law driving up the number of transistors on every chip, the inspection process for these complex devices must evolve to complement the recent advances in manufacturing. As the global leader in microfocus X-ray inspection, FEINFOCUS has historically and actively introduced innovative X-ray inspection solutions to the industry, such as our award winning WBI-FOX(TM) for wafer bump inspection. With Xradia's proven 3D imaging technology for IC packaging applications, our two companies can now provide a level of defect inspection that is unrivalled in the semiconductor packaging industry."
About FEINFOCUS: FEINFOCUS, a COMET business unit, is a leading global supplier of award-winning high-resolution X-ray inspection systems. The combined resources of COMET and FEINFOCUS provide the most complete offering of X-ray technology and products in the world. FEINFOCUS offers full radiation-shielded X-ray systems and X-ray sources, as well as complete in-house X-ray services, such as failure analysis, component defect detection, technical support, and preventative maintenance for both FEINFOCUS and third-party systems. As pioneers of microfocus and nanofocus X-ray inspection technology, the company developed the first patented "open" X-ray tube in 1982, and remains an industry leader in non-destructive testing for electronics, semiconductor, and related industries.
FEINFOCUS is headquartered in Garbsen, Germany. In the Americas, the company maintains sales, service, and applications labs in Stamford, CT and San Jose, CA. In Asia, the company's sales and service office is located in Shanghai, China.
About Xradia: Xradia, Inc. is a privately held company established in 2000 to commercialize high-resolution X-ray microscopes for non-destructive inspection and nano-scale imaging. Initially targeted at failure analysis in the semiconductor IC industry, subsequent developments have led to a suite of commercial X-ray imaging products that have permitted expansion into markets that include metrology in semiconductor IC production, scientific equipment, biomedical research and nanotechnology development. These advanced systems offer outstanding non-destructive imaging capabilities. These include nanometer resolution 3D imaging of complex objects, such as IC chips and biological specimens, and element-specific imaging for process control and monitoring in IC manufacturing. The company also supplies advanced X-ray imaging components and state of the art imaging systems to the synchrotron research community. The company is rapidly expanding in 2005 in response to demand for its unique X-ray imaging products.
