Press Release Summary:
Capable of handling boards up to 18 x 16 in., pcba/sentry comes with 160 kV X-ray tube and OVHM technology for up to 52Â° image angles. Its automated microfocus X-ray system is used for inspection and failure analysis of area array package assembly integrity. Besides diameter variations, percentage voids and form errors, BGA image analysis software repeatedly determines openings and wetting errors.
Original Press Release:
phoenix|x-ray's New pcba|sentry Determines BGA Opens And Improper Wetting - A First For Automated Systems
phoenix|x-ray Systems + Services Inc. today introduced the pcba|sentry, a new x-ray inspection system that fills the void between fast automated inline and offline semi-automatic or manual failure analysis systems. The new system is a fully automated microfocus x-ray system for inspection and failure analysis of area array package assembly integrity. In addition to diameter variations, percentage voids, form errors, mis-registrations, pitch, insufficient solder mass the powerful BGA image analysis software repeatedly determines opens and wetting errors instantly at known level of confidence, making it the first system of its kind. Its autoloader option means the pcba sentry is well suited for both production line inspection and failure analysis applications of PCBs destined for such applications as aviation, space and military as well as medium volume SMT production facilities where determination of defects are critical.
Determining BGA wetting process errors, especially opens, is the "holy grail" of x-ray inspection and failure analysis. To do this properly requires oblique views at high magnification (OVHM). The pcba|sentry excels at this because its imaging chain incorporates the most advanced OVHM technology, providing excellent imaging and enabling the system to make pass or fail decision in absolute terms and more accurately and repeatedly than an operator.
A new, unique image analysis software package combined with OVHM is the key to these measurements. An advanced analysis algorithm determines whether a ball is open or connected by how the solder has flowed during the reflow process. Pass-fail levels can be pre-selected by the software or adjusted by the operator.
Running on Windows NT or 2000 platform and intuitive for use by production operators, technicians and engineers will find the pcba|sentry provides the most advanced package for both production inspection and in depth process analysis. Inspection routines can be self learned or quickly selected by the operator. Common analysis tasks can also be saved and assembled into a complete test program and run to provide full range of process verification including voiding, shorts, misalignments and other common process errors in addition to opens and wetting analysis.
The pcba|sentry also incorporates board handling ease with an autoload feature providing reliability in alignments and facilitating its automatic capability. Since the new system gives 100% inspection in full planar rotation of package assembly defects, Failure Analysis can be done on the production floor and provide immediate and complete process feedback. This compares to Inline systems, while fast, can only determine ball alignments, misaligned components, and mis-shaped balls or poor solder formations but not opens or proper solder wetting. Most common practices then require the shipping of boards to an FA lab and awaiting the results. While waiting up to hours for the result, many boards may have been produced with errors, or the production line shut down - in either case, not an efficient choice. This means the pcba|sentry will allow fast production inspection with FA analysis, cutting time and improving yields.
Price and Availability
Capable of handling boards up to 18" x 16", the pcba|sentry comes standard with a 160 KV x-ray tube and OVHM technology for up to 52 degree image angles. The system offers fast and sophisticated inspection versatility at prices as low as $280,000, half of a typical inline machine. Delivery is 12 - 16 weeks ARO.