Press Release Summary:
Waffle Pack Packaging Service for low-volume and engineering runs, up to 100,000 qty per month, is suited for applications where use of specialized automated die handling equipment is not cost-effective. Also known as ChipPak or Waffle Pack, packaging service entails individual dies being picked from sawed wafer and placed into waffle tray. All containers and carriers for bare die products are labeled and sealed to protect die from damage or contamination.
Original Press Release:
New Waffle Pack Packaging Service for Low-Volume & Engineering Runs
Optrans Universal Corporation (OUC), the independent marketing arm of The Optrans Group and Optrans America Corporation (OAC), a fully-owned subsidiary of Optrans (JAPAN) Corporation (OJC), today announced the official launch of its Waffle Pack Packaging Service for Low-Volume & Engineering Runs (up to 100,000 qty per month).
"Despite rapid advancements in die handling equipment, it may not be cost effective to use specialized automated die handling equipment for low-volume and engineering runs. In fact, the number of waffle pack orders from many of our existing clients has been steadily increasing in the last 6 months. We are now excited to offer this service to other companies in North America and Europe," said Akiyo Homma, President of OAC.
"The Optrans Group has always prided itself on being a pioneer in its technology, as well as in its business philosophy. The Waffle Pack Packaging Service is just the beginning of a number of new products and services that we have planned for this year. There are more announcements on the way," said Dmitry Gelfand, Chief Operating Officer of OUC.
About the Waffle Pack Packaging
The Waffle Pack Packaging service, also known as ChipPak or Waffle Pack, is a process where individual dies are picked from a sawed wafer and placed into a waffle tray. All containers and carriers for Bare Die products are labeled and sealed to protect the die from damage or contamination. All orders are processed in a high-quality environment, rigorously maintained in accordance with industry standards.
About Optrans Universal Corporation
OPTRANS Corporation is proud to showcase the latest advances in LED (Light Emitting Diode Technology) packaging technology. Specifically, these include the following versatile original packaging:UV LED;Visible LED;LED;Point Source LED.
In addition to LEDs, OPTRANS Corporation is proud to showcase the latest advances in other optoelectronic technologies, including:Photodetectors;Photodiodes;Phototransisters.
OPTRANS Corporation, headquartered in Japan, with offices in the U.S, manufactures high-end, custom-design optoelectronic devices & systems for OEMs. With extensive internal custom engineering expertise & the most-up-to-date manufacturing processes, OPTRANS guarantees superior customer service & optimum product quality. OPTRANS' product line offers a versatile original packaging, including: UV LEDs, Visible LEDs, IR LEDs, POINT SOURCE LEDs, Photodiodes & Phototransistors.