Voltage Transformer is designed for server applications.
Press Release Summary:
Utilizing Sine Amplitude Converter (SAC)(TM) technology, VTM(TM) VIV0005TFJ operates with upstream PRM(TM) regulator to drive low voltage, high current processor, and memory arrays. It attains current density of 117 A/in.² in 32.5 x 22.0 x 6.7 mm VoI Chip package and enables thermal management through low thermal resistance. Compatible with standard pick-and-place and surface-mount assembly processes, device has impedance of less than 1 mW from DC to 1 MHz and K factor of 1/40.
Original Press Release:
Vicor Introduces 130 A VTM Voltage Transformer for Server Applications
Andover, MA, July 22, 2009...VoI Chip, Inc., a subsidiary of Vicor Corporation (NASDAQ: VICR) announced the mass production release of a new VTM(TM) voltage transformer, using Sine Amplitude Converter (SAC)(TM) technology, that offers significant performance enhancements for server applications. The VIV0005TFJ operates with an upstream PRM(TM) regulator to drive low voltage, high current processor and memory arrays and is 130 A DC, 195 A peak rating. The module's high efficiency - greater than 90 percent - reduces both system power consumption and heat dissipated at the load.
The VIV0005TFJ's SAC has an impedance of less than 1 mOhm from DC to 1 MHz, beyond the bandwidth of other solutions, which means that capacitance normally at the load can be located at the input to the converter. With a K factor of 1/40, this module can reduce the bulk capacitance value - used for transient response - by a factor of 1600, resulting in savings of board area, materials, and total system cost. The VIV0005TFJ is ideal for microprocessor and memory power applications that require high efficiency, fast transient response, low profile, and overall design flexibility. A VTM (VIV0007TFJ) with a K factor of 1/32 and 115 A DC output is also available.
The VIV0005TFJ achieves a current density of 117 A/in2 in the "full-size" (32.5 x 22.0 x 6.7 mm) VoI Chip package, compatible with standard pick-and-place and surface-mount assembly processes. The VoI Chip package enables flexible thermal management through low thermal resistance.
"This new high current VTM delivers 30 percent more current than previous versions, making a VoI Chip solution up to three times smaller than conventional solutions," says Stephen Oliver, VP of Marketing and Sales, "and that's from a high efficiency 48 V distribution rail, not lossy 12 V systems. The output range enables the VIV0005TFJ to deliver high current at the lowest voltages on any processor roadmap, including the lowest voltage required by Intel's VR12 server specification."
For pricing and ordering, contact Vicor Customer Service at 800-735-6200 or e-mail custserv@vicorpower.com. For a data sheet and more information on the VIV0005THJ and other VoI Chip products and demonstration boards, please visit www.vicorpower.com.
About VoI Chip
VoI Chip, Inc. specifies, designs, manufactures and markets VoI Chip power components to enable next-generation power architecture in high-end computing, ATE, telecom, solid-state lighting, and defense electronics markets worldwide.
About Vicor
Vicor Corporation designs, develops, manufactures, and markets modular power components and complete power systems used primarily by original equipment manufacturers (OEMs) in the communications, data processing, industrial control, test equipment, medical, and defense electronics markets.
