VoI Chip(TM) Bus Converter has 1,000+ W/in.³ power density.

Press Release Summary:



BCM(TM) module, B384F120T30, is Sine Amplitude Converter(TM) that operates from 360-400 Vdc primary bus to deliver isolated low-voltage secondary. Its 12 V nominal output can be paralleled for high-current outputs or connected in series to create 48 V bus. Measuring 1.28 x 0.87 x 0.26 in., package is compatible with pick-and-place SMT machinery and assembly processes. Product suits data center applications, powering individual cards or blades directly from HV distribution bus.



Original Press Release:



Vicor Announces New Off-Line, High-Density VoI Chip(TM) Bus Converter



Isolated 384 V to 12 V, 300 Watt converter for HV Distribution Systems

Andover, MA, April 18, 2007...Vicor Corporation (NASDAQ: VICR) announced the availability of a high-voltage VoI Chip bus converter with a power density of greater than 1000 W/in3. Designated B384F120T30, this BCM(TM) module is a high-efficiency (>95%), Sine Amplitude Converter(TM) (SAC) operating from a 360-400 Vdc primary bus to deliver an isolated low-voltage secondary.

The 12V (nominal) output can be paralleled for high current outputs or connected in series to create a 48V bus, making the converter ideal for use in high performance server and telecom AC-DC SMPS and enabling major power density improvements in the post-PFC DC-DC stage. The BCM converter may also be used in high-power, high-efficiency data center applications to power individual cards or blades directly from the HV distribution bus.

The VoI Chip package - measuring just 1.28" x 0.87" x 0.26" - is compatible with standard pick-and-place surface-mount machinery and assembly processes. It provides flexible thermal management through its low junction-to-case and junction-to-board thermal resistance. The low impedance of the BCM converter enables POL capacitance minimization or elimination while the positive temperature coefficient of the output means that converters share simply and reliably with no interconnect circuitry; all resulting in savings of board area, materials, and total system cost.

"The high voltage BCM provides a large voltage step down and line isolation while achieving a power density more than 1,000 W/cubic inch," according to Stephen Oliver, Vice President of Marketing and Sales. "The new 1.2 kW demo boards highlight the high performance and flexibility of the 300W BCM converters in many application systems."

The Bus Converter Module B384F120T30 is priced at $37.50 in OEM quantities, and is available immediately from stock. Single 300 W BCM evaluation boards and two new 1.2 kW demo boards (12 V, 100 A or 48 V, 25 A outputs) are also available from stock and priced at $99 for the single BCM board and $399 each for the 1.2kW demo boards. To order, contact Vicor Customer Service at 800-735-6200 or e-mail custserv@vicr.com.

For data sheets and more information on VoI Chip products, including application notes and demo board user guides, please visit the Vicor website at www.vicorpower.com.

Vicor Corporation designs, develops, manufactures, and markets modular power components and complete power systems used primarily by original equipment manufacturers (OEMs) in the communications, data processing, industrial control, test equipment, medical, and defense electronics markets.

Technical Contact:
Jeffrey Hord
Sr. Product Marketing Manager VoI Chip
978-749-3268
jhord@vicor.com

Bus Converter Module (BCM), Sine Amplitude Converter (SAC), VoI Chip, and Vicor Corporation are trademarks of Vicor Corporation.

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