Vertical Gyro and AHRS are based on MEMS sensors.
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Press Release Summary:
Vertical Gyro (MMQ(TM)-VG) and Attitude, Heading, and Reference System (MMQ(TM)-AHRS) incorporate Six-Degree-of-Freedom MEMS Inertial Measurement Unit, which provides Roll, Pitch, and Heading (AHRS only) angle solution in varying dynamic conditions. Roll and Pitch are stabilized by IMU accelerometers, and heading is stabilized by external 3-axis magnetometer. While Vertical Gyro meets TSO-C4c Bank and Pitch angle requirements, AHRS meets TSO-C4c and TSO-C6D Heading performance.
Original Press Release:
New MEMS-Based Vertical Gyro (MMQ-VG) and Attitude, Heading, and Reference System (MMQ-AHRS)
Systron Donner Inertial (SDI), a global business unit of Custom Sensors & Technologies (CST) is pleased to introduce their new MEMS-based Vertical Gyro (MMQ-VG) and Attitude, Heading, and Reference System (MMQ-AHRS).
These two new products MMQ-VG and MMQ-AHRS are fully functional Quartz MEMS sensor-based systems housed in a compact and light weight package. At the heart of each unit is SDI's Six-Degree-of-Freedom MEMS Inertial Measurement Unit (IMU) which provides a highly accurate Roll, Pitch, and Heading (AHRS only) angle solution in varying dynamic conditions. Roll and Pitch are stabilized by the IMU accelerometers and heading is stabilized by an external three-axis magnetometer. The Vertical Gyro meets TSO-C4c Bank and Pitch angle requirements while the AHRS meets TSO-C4c as well as TSO-C6D Heading performance standards all the while providing the ultimate in MEMS rate sensor performance at 0.15 degrees/square root hour noise with stability under 10 degrees/hour.
The data output is user-configurable at various sample rates with extremely low output rate jitter. The easily understood data format contains six sensor outputs, the angle outputs, a Built-In-Test (BIT) word output, and a multi-parameter revolving word output providing system information including version string. The new SDI MMQ-VG and MMQ-AHRS combine outstanding performance and versatility within an extremely compact, low power consumption, and light-weight package.
