Vertical Edge Card Socket has high-density design.
Press Release Summary:
Featuring up to 140 contacts on 0.50 mm pitch, BEC5C Series suits high-speed applications requiring board space conservation. Dual beam bi-level contact system, staggered 0.5 mm pitch, reduces card mating force without reducing reliability. Available for 1.60 and 2.36 mm card thicknesses, socket features Phosphor Bronze contact, weld tabs, alignment pins, and lead-free solder crimp terminations. Tin-lead solder charges, as well as alternative platings and pin counts, are available.
Original Press Release:
New Edge Card Socket Combines High Density with Lower Cost
Samtec’s line of high speed edge card solutions now includes a new high density edge card socket (BEC5C Series) featuring up to 140 total contacts on 0,50 mm pitch. This micro card socket is ideal for high speed applications requiring board space savings. The dual beam bi-level contact system is on a staggered 0,5 mm pitch, which reduces card mating force without reducing reliability. This vertical socket is available for both .062" (1,60 mm) and .093" (2,36 mm) card thicknesses. Standard features include a lower cost Phosphor Bronze contact, weld tabs, alignment pins and lead-free solder crimp terminations for easy board processing. Tin-lead solder charges, as well as alternative platings and pin counts, are also available.
Samtec offers a complete line of High Speed Edge Card Sockets in a variety of pitches from 0,50 mm to 2 mm. Orientations include vertical, right-angle and edge-mount designs to support high density, standard and specific application needs.
Samtec’s Signal Integrity Group provides application support via its in-house Signal Integrity engineers for this edge card socket and many other products. These highly qualified engineers help with application specific design, modeling and testing as well as interpretation of the test data and performance results, and much more.
For product specifications, see www.samtec.com?BEC5C
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