Press Release Summary:
Designed to meet carrier requirements for all xDSL deployments, 65 nm VINAX(TM) V3 can drive data rates up to 150 Mbps/downstream and 100 Mbps/upstream on single line, supporting such services as HD IPTV, high-speed Internet access, multi-player gaming networks, and VoIP. Unit consumes 0.9 W/channel to meet future Green design goals for broadband infrastructure. Measuring 29 x 29 mm, device integrates MELT controller for remote line testing by carriers with no external equipment needed.
Original Press Release:
Lantiq Samples Industry's Lowest Power, Smallest Footprint VDSL2 Chipset to Drive Broadband Innovation
MUNICH and NEUBIBERG, Germany, -- Lantiq, a leading supplier of broadband access and home networking technologies, today introduced its latest generation 65nm chipset for design of carrier linecards supporting the global VDSL2 and ADSL/2/2+ standards. VINAX(TM) V3 gives network equipment vendors a single solution to meet carrier requirements for all xDSL deployments, featuring a level of integration unsurpassed in the industry, the flexibility to support multiple transmission profiles and emerging technology enhancements, and leading low-power performance.
Highlights of the VINAX V3 chipset include:
-- Industry-leading power consumption of just 0.9W per channel to meet future green design goals for broadband infrastructure, including requirements defined in the EU Code of Conduct (CoC) on Energy Consumption of Broadband Equipment. VINAX V3 also is the first VDSL2 solution to work with either Class AB or low-power Class H line drivers.
-- Smallest package size and highest channel count (per chipset) in the industry allows double VDSL2 linecard density compared to all on-market alternatives. Each VINAX V3 chipset occupies an area of 29 mm x 29 mm for 16 channels in VDSL2 Profile 17a. An 8-channel solution for VDSL2 profile 30a requires 30 percent less area.
-- Industry first on-chip integration of a MELT controller for remote line testing by carriers with no external equipment needed.
-- Overall, feature integration on the VINAX V3 chipset reduces the external Bill of Materials (BOM) cost by 50 percent.
The VINAX V3 chipset can drive data rates up to 150 Mbps/downstream and 100 Mbps/upstream on a single line, supporting such services as HD IPTV, high-speed Internet access, multi-player gaming networks and VoIP. VINAX V3 supports line bonding techniques at chip and linecard levels that boost data-rate or data-reach for home and business users and supports mobile backhaul applications with up to 500 Mbps symmetrical data rates. It also is the industry's first chipset ready to support full System Vectoring, a VDSL2 enhancement that will reduce crosstalk in dense cable bundles.
Network equipment OEMs will benefit from an extensive set of chip-level enhancements and features integrated into the new chipset, while software compatibility with Lantiq's current VDSL2 chipset reduces time-to-market and cost. For example, VINAX V3 uses the same Analog Front End (AFE) chip to support all of the VDSL2 profiles. The same PCB design can be used for a card deployed at a DSLAM or CO (Profile 17a, supporting up to 100 Mbps downstream/50 Mbps upstream) and a MDU card running Profile 30a (up to 150 Mbps downstream/100 Mbps upstream). Higher density cards, up to 72 channels compared to 24 - 48 channels with earlier generation chipsets, reduce costs for both system vendors and carriers.
"VDSL2 is the key technology for successful triple-play service delivery in next-generation network deployments. VINAX V3 provides breakthrough performance, best-in-class feature set and unsurpassed flexibility for network upgrades and new deployments," said Hubert Christl, Senior Vice President and General Manager of Lantiq's Access Networks Business Unit. "Lantiq integrated the capabilities that leading carriers across the globe demand as they accelerate roll-out of VDSL2, including cost optimization and improved energy efficiency."
VDSL2 linecards are a key technology supporting robust delivery of residential broadband services over both traditional copper-wire infrastructure and in FTTC/FTTB networks. According to Broadband Forum estimates (June 2010), more than 60 percent of the 484 million broadband lines installed today are driven by ADSL or VDSL technology. Further, market research firm iSuppli forecasts that 600 million new xDSL channels will be deployed from 2010 to 2014. Carriers that are planning or have begun the transition from ADSL/2/2+ to higher data rates can use VINAX V3-based linecards that require only a firmware change to upgrade to VDSL2 services.
The VINAX V3 chipset, including Digital Front End (DFE), Analog Front End (AFE) and line drivers, is now sampling to lead customers. For more information, please visit: http://www.lantiq.com/VINAX-V3
Lantiq offers a broad and innovative product portfolio for next-generation networks and the digital home. The company has a global team of about 1,000 experts in Europe, North America, the Middle East and the Asia Pacific regions. The company is headquartered in Neubiberg just outside of Munich, Germany and specializes in broadband communications encompassing analog, digital and mixed-signal ICs along with comprehensive software suites. Lantiq is a fabless company and its semiconductor solutions are deployed by major carriers and in home networks in every region of the world. Further information is available at: http://www.lantiq.com/
CONTACT: Christoph von Schierstaedt, +49-89-89899-7322, Schierstaedt@lantiq.com, or North America, Sarah LaLiberte, +1-978-502-8558, Sarah.LaLiberte@lantiq.com, both of Lantiq
Web Site: http://www.lantiq.com/