Press Release Summary:
Respectively, FT600Q and FT601Q come in 56- and 76-pin QFN packages and feature 16- and 32-bit wide FIFO bus interface. Both chips, which function as SuperSpeed USB 3.0 to FIFO bridges, support up to 8 endpoints (other than management endpoints) linked to configurable buffers of 16 KB length for in and 16 KB for out. Providing data bursting rates up to 3.2 Gbps, USB 3.0 products support 2 interfacing modes: 245 FIFO mode and multi-channel FIFO mode.
Original Press Release:
FTDI Chip Launches Sophisticated USB 3.0 Interface Solution in Low Pin Count Package
The FT600Q and FT601Q are FTDI Chip’s first generation USB 3.0 products that function as SuperSpeed USB 3.0 to FIFO bridges, providing data bursting rates of up to 3.2Gbps. The FT600Q comes in 56-pin QFN package and has a 16-bit wide FIFO bus interface, while FT601Q comes in 76-pin QFN package and has a 32-bit wide FIFO bus interface. Both these chips support up to 8 endpoints, other than the management endpoints. The endpoints are linked to a configurable endpoint buffers of 16kByte length for IN and 16kByte for OUT.
Both FT600Q and FT601Q support two interfacing modes; the 245 FIFO mode and the multi-channel FIFO mode, and thus provide more flexibility for system designers. The 245 FIFO mode has a simpler protocol, but for more sophisticated customers, the multi-channel FIFO mode supports up to 4 logical FIFO channels and data structures optimised for higher throughputs. The FIFO is provided with a 16kByte configurable buffer.
The remote wake up function on these chips can be used to rapidly bring the USB host controller out of suspend mode. The USB battery charger detection function enables USB peripheral devices to detect the presence of a higher current power source in order to boost charging capabilities. It means that the FT600 can detect connection to a USB-compliant dedicated charging port (DCP) and transmit a signal allowing external logic to switch to charging mode. The IC can also benefit from the higher power delivery capabilities that the USB 3.0 standard supports while still being able to transfer data.
Engineers are furnished with a great deal of flexibility to configure FT600/1Q to their desired application. Among these are multi-function printers, scanners, high resolution video cameras, still image cameras, high definition displays, data acquisition systems, surveillance equipment and medical/industrial imaging systems.
The FT600Q and FT601Q ICs have an operating temperature range that covers -40°C to 85°C. Catering for a design which incorporates multiple data endpoints, a completely new driver architecture has been developed and optimised to extract full performance from the system whilst maintaining FTDI Chip’s standard D2xx API. Driver support provided allows the device to be used with Windows, Linux and Mac operating systems.
For more information on these products visit: http://www.ftdichip.com/Products/ICs/FT600.html
About FTDI Chip
FTDI Chip develops innovative silicon and software solutions capable of enhancing the way that people interact with today’s technology. Through application of its “made easy” principle, the company is able to support engineers with highly sophisticated, feature-packed, simple-to-use and robust product platforms which enable the creation of electronic designs that have higher performance, fewer peripheral components and lower power budgets, as well as utilising less board space. These products are focussed on making advancements two fundamental areas; the transferring of data between electronic devices via Universal Serial Bus (USB) interconnects and Graphic User Interface (GUI) implementation. Its long-established and ever expanding USB portfolio, which comes with proven, ready-to-use, royalty-free firmware and driver support for all major operating systems, includes peripheral, host and bridge chips, as well as highly integrated system solutions with built-in microcontroller functionality. These are complemented by its graphic controllers which, which by taking a unique, more streamlined approach, allow engineers to dramatically reduce the development time and bill-of-materials costs involved in implementing next generation GUIs. They combine display, audio and touch functionality in a single compact package and are offered along with an array of development modules and software.
FTDI Chip follows a fab-less semiconductor model, partnering with the world’s leading foundries. The company is headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China).
For more information go to http://www.ftdichip.com
Regional sales offices and distributor lists are available at http://www.ftdichip.com/FTSalesNetwork.htm
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