Update Your Palomar Bonder with Performance Upgrade Packages
Includes Bond Data Miner Software
Carlsbad, Calif. - January 4, 2007 - Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, is making available bonder Performance Upgrade Packages for its CBT6000 and Model 8000 automatic wire bonders and the Model 3500 component placement work cell. The upgrade packages include the latest operating software, improved vision systems for pattern recognition, and new features like Bond Data Miner(TM) (known as BDM). BDM, included in Palomar's current bonder models, is a software package that monitors machine and process trends to provide increased yields and predictive maintenance. Bond Data Miner can: track and archive traceability data for each part, die, wire and bond; automatically adapt its process parameters to address lot to lot and/or part variations; capture and analyze process and machine trends to optimize yield; and report its own uptime and statistics to any computer in the world.
About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is one of the world's principal suppliers of automated high-precision wire bonders and component placement systems to increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.
For more information, visit www.palomartechnologies.com or contact 760Â-931-3600.
