Universal Highlights New Platform and Emerging Market Focus at APEX 2012


Universal Instruments sets a higher standard for versatility and performance in a multifunction surface mount platform with the introduction of the Genesis GX-37D to the Americas market at the APEX 2012 tradeshow in San Diego, CA, February 28 - March 1. Universal will demonstrate the exceptional capabilities of the GX-37D on booth #2737, as well as share the company's vision into the exciting new markets shaping the industry landscape and Universal's unique position as a productivity and profitability leader in these markets.

Brad Bennett, Universal's Vice President of Sales, notes the significance of the company's newest platform, "As the originator of the SM platform concept, the objective has always been to afford our customers the highest level of cost-effective performance in a flexible module that readily adapts to their unique requirements. By placing chips at high speed and extending through extreme odd-form component placement, the GX-37D stands as the pinnacle of our platform lineage and substantially expands the range of opportunities for our customer base. Its versatility makes it an effective single-machine solution, line-balancer or powerful end-of-line solution in a compact footprint." Bennett adds, "Since introducing the GX-37D at Productronica in November, we've seen it enjoy success in each of these capacities.

As the only electronics assembly equipment provider in the U.S., it's particularly rewarding for us to showcase this new platform here at APEX." Additionally, Universal will demonstrate the Advantis® AC-90T Platform - the NPI Award winner in its class at last year's APEX event. The AC-90T is the highest-performance platform available for cost-sensitive production, delivering the necessary throughput for high-volume OEM requirements and the flexibility to ensure high utilization and productivity in high- changeover CEM environments. To complement its platform offering, Universal will feature its Dimensions® Shop Floor Control Software, which maximizes ROI by providing visibility into production line performance with the Linechart module, and tracking materials and optimizing utilization with the Line Manager module.

Also on Universal's booth will be the Innova Die Handler, providing high-speed die delivery for cost-effective production. Innova combines with Universal's GenesisSC Platform to present a powerful Advanced Packaging solution to support the advances in silicon and packaging technologies that are propelling product miniaturization by means of increased functionality and performance within a progressively smaller footprint. Innova offers exceptional flexibility, improved yields and lower assembly costs for applications such as Flip Chip, Embedded, Multi- Chip Module (MCM), System-in-Package (SiP) and Package-on-Package (PoP).

While Universal's latest technologies play a critical role in driving the success of its customers, it's the company's ability to apply these technologies as a component of comprehensive, market-focused solutions that distinguishes Universal as an industry leader. Universal's Vice President of Marketing, Debbora Ahlgren states, "With our "advance, adapt, achieve" show theme at this year's APEX event, we're encouraging our customers to think outside of the 'box' and recognize the broader scope of elements that will enable their sustained profitability. This is even more important now as our industry landscape is evolving as a result of a move towards greener technologies such as Concentrated Photovoltaic (Solar), Solid-State Lighting and more efficient Power Conversion."

Ahlgren continues, "Manufacturers must progressively advance their technologies with an adaptable, future-ready equipment set and our expansive portfolio across a range of applications meets the diverse challenges of the emerging markets. Manufacturers must also have the ability to adapt to new processes and our Advanced Process Lab provides industry-leading expertise to support that transition. Ultimately, to maintain competitive advantage and achieve the highest level success, these factors must be cohesively integrated and Universal remains committed to this complete-solution approach to deliver maximum value and return for our customers."

Genesis Product Information:

Universal Instruments' Genesis is the most capable placement platform available, delivering the ultimate in modular performance for standard to extreme surface mount applications. The Genesis portfolio provides outstanding price performance, a low total cost of ownership and superb uptime and repeatability while offering extended investment protection. Genesis enables semiconductor performance at surface mount speeds with 1ìm positioning, while maintaining the flexibility to take on any odd-form challenge. Key features include patented Lightning® Head technology - the industry's fastest, complementary placement heads with a large overlap in component range, on-the-head Vertical Part Sensor (VPS), board size capability up to 1016mm long, and a flexible range of optics and lighting configurations to support any
application.

Advantis Product Information:

The Advantis 3 portfolio includes both single- and triple-beam base models. Advantis 3 features an affordable entry price and low maintenance costs with VRM linear motor technology that provides improved accuracy, acceleration and velocity without the downtime of lead screwdriven positioning systems. Additional class-exclusive technologies such as the 30-spindle Lightning® head - the industry's fastest - and a host of easily integrated performance options provide superior investment protection for growing requirements.

Advantis 3 is the only truly modular placement platform, as vision capability can be expanded or spindles added without changing heads, for a throughput of up to 34,400 cph. A class-leading component range of 0201 passives through 150mm connectors and a large overlapping range between placement heads maximize utilization. A comprehensive suite of NPI software tools assists from new product introduction throughout production to achieve 100% first-pass yields and ensure the best possible PPM.

Universal Instruments:

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS Providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, with offices in Europe, Asia, and the Americas.

Universal contact

Jeffrey Zopff

Universal Instruments Corporation

33 Broome Corporate Parkway

Conklin, NY 13748

USA

Tel: +1 607 779 5364

Email: zopff@uic.com

www.uic.com

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