Universal Contact provides 90° mating angle.
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Press Release Summary:
Providing vertical electrical connection between device and PC board, Universal Contact for angular alignment applications features sloped front beam with 90° mating angle. Features include 2.5 mm free height, 1.0 mm deflection, solder well that prevents wicking of flux solder into beam area, and side wings to prevent beam overstress. Additional features include domed contact for high hertz forces, minimum pre-load force of 0.3 N, contact pitch of 1.35 mm, and voltage rating to 500 Vdc.
Original Press Release:
ITT Interconnect Solutions Develops Universal Contact for Angular Alignment Applications
SANTA ANA, CA - ITT Interconnect Solutions, a leading global manufacturer and supplier of connectors, interconnects, and cable assemblies, has enhanced its family of Universal Contacts to suit applications requiring angular alignment. The Universal Contact for angular alignment provides a vertical electrical connection between a device and the PC board, while also allowing angular mating in the same footprint as a standard Universal Contact.
"We developed the Universal Contact for angular alignment within an extremely tight timeframe of just four weeks from design through production, allowing our first end customer to produce 2.5 million handheld units in only 60 days," said Keith Teichmann, director of marketing for ITT Interconnect Solutions. "The new Universal Contact is ideal for mobile handset applications, as the contacts can be used for solderless component and I/O interconnects as well as battery and antenna contacts."
Additional angular alignment applications for the Universal Contact include memory sticks, GPS board-to-screen connections, CT scanning equipment, key fobs and smoke detectors.
The Universal Contact for angular alignment applications features a sloped front beam, enabling a mating angle of 90 degrees while still retaining the same dimensions as standard Universal Contacts (2.5mm free height, 1.0mm deflection, and X-Y-Z movement). A solder well prevents wicking of flux solder into the critical beam area, and side wings prevent beam overstress. Additional features include a domed contact for high hertz forces, minimum pre-load force of 0.3N, contact pitch of 1.35mm, and voltage rating to 500VDC.
Typical pricing for the Universal Contact for angular alignment applications ranges from $0.075 to $0.095 each depending on volume. Lead time is from 8 to 10 weeks.
About ITT Interconnect Solutions
ITT Interconnect Solutions is an international manufacturer and supplier of connectors including circular, rectangular, fiber optic, RF, power and high voltage, audio, PCMCIA, Compact Flash Card, enclosures, cable assemblies, and application specific custom solutions. The Interconnect Solutions portfolio includes the brands Cannon, VEAM, and BIW. For more information on ITT Interconnect Solutions and an archive of its press releases, please visit www.ittcannon.com.
About ITT
ITT Corporation is a high-technology engineering and manufacturing company operating on all seven continents in three vital markets: water and fluids management, global defense and security, and motion and flow control. With a heritage of innovation, ITT partners with its customers to deliver extraordinary solutions that create more livable environments, provide protection and safety and connect our world. Headquartered in White Plains, N.Y., the company generated 2008 sales of $11.7 billion. www.itt.com.
