Universal Automates Success at SMT Hybrid Packaging 2015
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Flexible technology lineup enables winning formula for automating contemporary odd-form challenges.
Universal Instruments will display two solutions from its automated odd-form assembly portfolio at the SMT Hybrid Packaging trade show to be held May 5–7 at the Exhibition Centre Nuremberg in Germany. The company will feature its FuzionOF™ Platform and Polaris Assembly Cell, exhibiting on Hall 7 Stand 7-221 in cooperation with channel partner, smartTec GmbH.
FuzionOF is the most recent addition to Universal’s award-winning Fuzion® Platform family. FuzionOF makes odd-form automation standard by leveraging the most complete range of component handling and input types, as well as a wide variety of flexible tooling options. As the fastest and most versatile high-speed automation platform, FuzionOF delivers exceptional performance for a complete range of standard surface mount, pin-inpaste odd-form, and surface mount odd-form applications.
Glenn Farris, Universal Instruments Vice President of Marketing explained, “Here in Europe and similarly from a global perspective, product complexity is increasing and designs evolving to meet performance demands, creating a fast-moving targetfor electronics assembly equipment manufacturers.” Farris continued, “Our approach with FuzionOF was to provide an exceptionally adaptable pre- and post-reflow solution to boost productivity and mitigate the risks associated with uncertainty.”
Also on the booth will be the Polaris Assembly Cell, configured with servo-gripper tooling and demonstrating its versatile odd-form capabilities. Polaris automates a variety of processes, including pick and place for large and complex devices, dispensing, bar code reading, vision, screw driving, and labeling. A standard interface and large tooling portfolio enable efficient automation of a wide range of complex front- and back-end assembly applications on a common platform.
Complementary to the automation solutions on the booth, Universal also offers the Radial 88HT through-hole platform, which automates the insertion of tape-packaged radial components faster and more reliably than manual processes. The Radial 88HT supports a full range of lead spans to maximize automation opportunities.
“In order to maintain a leadership position in the modern electronics assembly landscape, it’s essential for manufacturers to take advantage of the cost, yield and productivity benefits afforded by automation,” commented Farris. “With our comprehensive solutions offering, we can help alleviate manual assembly processes in any production environment, regardless of product mix or volumes.”
To learn more about Universal Instruments Europe, please contact: Universal Instruments – Koen Vinck, area general manager, +32 331 49540 or vinckk@uic.com; smartTec – Frank Wiethüchter, sales director and coowner, +49 163 5006213 or fw@smarttec.de.
About Universal Instruments
Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal Instruments delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation. Universal Instruments is headquartered in Conklin, N.Y., USA, with offices in Europe, Asia and the Americas.
Universal Instruments contact
Jeffrey Zopff
Global Marketing Communications Manager
Universal Instruments Corporation
33 Broome Corporate Parkway
Conklin, NY 13748
USA
Tel: +1 607.779.5364
Email: zopff@uic.com
www.uic.com
