Underfill targets lead-free CSP and BGA devices.
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Press Release Summary:
Pre-applied to board at corners of CSP pad site using standard dispensing system, one-component Loctite® Cornerbond(TM) 3508 cures during normal lead-free solder reflow, allowing for self-alignment of IC components. It provides 6-month shelf life, pot life greater than 75 hr, and ability to use standard refrigerated storage. Reworkable feature enables defective components to be removed without requiring entire assembly to be scrapped.
Original Press Release:
Henkel Launches New Pb-free Compatible CSP Cornerbond(TM) Underfill for Improved Reliability of Mobile Devices
The latest in a series of productivity enhancing material solutions, Loctite® 3508 from Henkel is a unique Cornerbond(TM) underfill system designed specifically for CSP and BGA devices processed in lead-free environments. The innovative characteristics of the material deliver several benefits including higher throughput, reduced manufacturing costs and improved pot life, which all combine to provide manufacturers with measurable manufacturing efficiencies.
Loctite 3508 is a one-component epoxy cornerfill engineered for process optimization with curing taking place during normal lead-free solder reflow and allowing for self alignment of IC components. Unlike traditional capillary underfills which are dispensed around the edges of the device and then flow underneath it, Loctite 3508 is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. The in-line dispensing and reflow curing capabilities speed assembly and reduce costs through the elimination of post-reflow dispensers and curing operations.
"Often, manufacturers are faced with making the choice between high UPH or improved reliability," says Robert Chu, Henkel Global Product Manager for Underfills. "With Loctite 3508, assembly specialists can have the best of both worlds - fast, in-line assembly and better reliability."
With a six month shelf-life, a pot life greater than 75 hours and the ability to use standard refrigerated storage, Loctite 3508 presents manufacturers with tremendous production flexibility and delivers outstanding product longevity. Other advantages of the material include improved adhesive strength over previous versions and a reworkable feature which enables defective components to be removed without requiring the entire assembly to be scrapped.
"Today's mobile products contain multiple CSPs and Loctite 3508 delivers a cost-effective, improved reliability alternative for manufacturers seeking to improve UPH and reduce overall manufacturing expense for certain applications such as laptops and gaming consoles," concludes Chu.
For more information please log on to .henkel.com/electronics or call the company's Irvine, California headquarters at 949-789-2500.
About the electronics group of Henkel
Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronics Industry.
Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal Care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. In fiscal 2005 Henkel generated sales of 11.974 billion euros. A leader in brands and technologies, Henkel makes people's lives easier, better, and more beautiful. More than 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
Contact
Henkel Corporation
Doug Dixon
Phone: 949-789-2500
Fax: 949-785-2595
doug.dixon@us.henkel.com
www.electronics.henkel.com
