Ultratech Wins 2007 Advanced Packaging Award for 3D Packaging Innovation
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The AP300 DSA Lithography System Features Through-Silicon Via Alignment Capability
SAN JOSE, Calif., July 26 / / - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors for flat-panel displays, today announced that its AP300 Dual-Side Alignment (DSA) lithography system won the 2007 Advanced Packaging Award (APA) in the category of 3D Packaging. Ultratech's AP300 DSA system was honored for its innovative through-silicon via (TSV) alignment capability for 300-mm, 3D-packaging applications. The APA glass statuette was presented to Ultratech during a ceremony at the San Francisco Museum of Modern Art (MoMA) on July 18. This distinctive award reinforces Ultratech's industry-leading technology to develop innovative and enabling advanced-packaging lithography solutions for its global customers.
Advanced Packaging Magazine Editor-in-Chief Gail Flower noted, "The Advanced Packaging Award is the premier recognition for innovation leadership in the semiconductor packaging industry. It recognizes companies with new ideas in products and services that prove to save on cost, to be environmentally responsible and to move the technology forward. This year's APA in the category of 3D Packaging went to Ultratech for its TSV alignment method. Ultratech's AP300 DSA lithography system uses a front-side infrared (IR) approach to perform dual-side alignment, achieving front-to-back overlay of less than 2 microns over a 300-mm wafer. We congratulate them for this remarkable creative innovation in packaging."
"We are honored to receive this industry recognition from Advanced Packaging Magazine," explained Manish Ranjan, Ultratech's director of marketing. "To address the market requirements for dual-side alignment, we have worked closely with customers over several quarters and gained greater insight into the lithography requirements for TSV structures. As a result, Ultratech developed the innovative front-to-back-side alignment for the AP300 system, which is production proven to support a broad range of packaging applications. We now have multiple systems with this innovative feature in production. Ultratech will continue to develop innovative products that enable our global customers' advanced-packaging lithography applications in the most cost-effective fashion."
Three-dimensional packaging designs greatly enhance the performance of integrated circuits, while minimizing the overall packaging form factor. These advanced system-in-package (SiP) techniques require TSVs to allow very high-density vertical interchip wiring of multiple device stacks. Lithography techniques utilizing DSA technology is one of the preferred methods for creation of the TSV structures, and is anticipated to be a key enabler for customers requiring TSV features for 3D-packaging and SiP applications.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography, in addition to being a pioneer of laser processing. Its advanced-packaging lithography systems deliver strong cost-of-ownership, repeatability and throughput advantages, and are used worldwide in the fabrication of semiconductors and FPDs. Ultratech's advanced laser processing technology enhances yields, while enabling a cost-effective transfer to 65-nm and below production, and is being integrated into the manufacturing lines of leading-edge semiconductor manufacturers. Ultratech's home page on the World Wide Web is located at: www.ultratech.com.
