Ultratech's AP300 Lithography Systems Chosen for Next Generation High-Volume, Fan-Out Wafer-Level Packaging Application
SAN JOSE, Calif., – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a large multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems. The AP300 systems will be utilized for high-volume, fan-out wafer-level packaging (WLP) applications used to manufacture leading-edge chips. Ultratech will begin shipping the systems in Q4FY15 to the customer's facility in Taiwan.
The strong demand for thin mobile communication devices such as smartphones and tablets continues to drive growth in WLP. Due to the costs associated with 3D through-silicon via (TSV) architectures, industry analysts regard fan-out WLP as an effective solution for the highly demanding mobile and wireless market where the focus is on delivering high performance coupled with a small form factor.
Ultratech's General Manager and Vice President of Lithography Products Rezwan Lateef stated, "Fan-out technologies provide a cost-effective packaging solution that enables smaller form factors, increased I/O density and excellent electrical and thermal performance. By working closely with our customers and continuing to invest in product RD, Ultratech successfully addresses challenging fan-out issues, such as chip-to-mold non-planarity, die shift misalignment and wafer warpage, while providing outstanding cost-of-ownership. This major order clearly validates our technology leadership and the value proposition of our AP300 systems. We look forward to building on our relationship with this valued customer and supporting their aggressive technology roadmap for the next generation of mobile devices."
The Ultratech AP300 Family of Lithography Steppers
The AP300 family of lithography systems is built on Ultratech's customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost-effective manufacturing. These systems are particularly well suited for Cu pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as Ultratech's award winning dual-side alignment (DSA) system, utilized around the world in volume production.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front-end semiconductor, back-end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high-brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
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