Ultratech Receives Expansion Order from Asian Foundry for Laser Spike Annealing System
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Order Further Validates the Continued Value Ultratech's LSA101 Systems Provide Foundries for 28-nm Production
SAN JOSE, Calif. - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced an expansion order from a foundry in Asia to add capacity for 28-nm production. The Ultratech LSA101 laser spike anneal system was chosen with the dual-beam option, which provides flexibility for annealing at low substrate temperatures. The LSA101 is designed for advanced applicaÂtions, such as gate stack formation, silicide or post-silicide anneal. Ultratech plans to ship the LSA101 tool to the customer's foundry in Asia in the fourth quarter of 2016.
"This follow-on order reinforces the growing opportunities that we are experiencing from Asian foundries for our LSA101 systems," said Scott Zafiropoulo, General Manager of LSA and Senior Vice President of Marketing at Ultratech. "The low cost of 28-nm planar technology continues to drive the growth and capacity expansion for foundries in Asia looking to take advantage of the optimal performance-to-cost ratio at this node. While this order is to expand capacity for the 28-nm node, our long-time relationship with this valued customer began with their use of Ultratech's LSA systems at the 40- and 45-nm nodes. Today, we continue to provide Ultratech's advanced LSA technology for their 14-nm production, and we look forward to supporting their efforts at the 10-nm and below nodes."
Ultratech LSA101 Dual-Beam Laser Spike Anneal System
Built on the customizable Unity Platform™, LSA101 with the dual-beam option expands the process space by adding a second low-power laser beam that adds process flexibility and enables millisecond annealing with a low substrate temperature. Inserting a millisecond anneal step post-junction formation, such as gate stack formation, silicide or post-silicide anneal, has been shown to improve leakage and device reliability, while reducing contact resistance and improving both performance and yield. The LSA101 delivers high flexibility and extendibility for advanced annealing applications and is currently in high-volume production for advanced planar and FinFET devices.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: frontÂ-end semiconductor, backÂ-end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high-brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
(UTEKG)
Unity Platform is a trademark of Ultratech, Inc.
Company Contacts:
Ultratech
Bruce R. Wright
Senior Vice President CFO
Phone:Â 408-321-8835
Media Relations:
MCA, Inc.
Angie Kellen, 650-968-8900
Senior Account Director
akellen@mcapr.com
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Ultratech, Inc.
3050 Zanker Road, San Jose, CA, 95134, United States
www.ultratech.com
