Type 6 COM Express Module withstands harsh environments.

Press Release Summary:

Featuring R-Series SoC from AMD for extensive graphics capabilities, Model bCOM6-L1700 supports up to 16 GB of soldered memory, 4 SATA interfaces, Gigabit Ethernet port, 8 USB 2.0 ports, 4 USB 3.0 ports, and either 8 GPIO ports or SD Card interface. Extended mechanical construction protects module, which is designed for optional conformal coating for greater resistance to moisture, dust, chemicals, and temperature extremes. Dynamic thermal management helps prevent damage.

Original Press Release:

New Module from GE Brings Benefits of COM Express Architecture to Harsh Environments

Fully rugged bCOM6-L1700 delivers high performance for demanding applications

GE provides customer support for custom configurations

Further extends GE’s growing range of COM Express solutions

CHARLOTTESVILLE, VA. — GE’s Intelligent Platforms  business (NYSE: GE) today announced at Embedded World (Nuremberg, Germany – 24-26 February) the fully rugged bCOM6-L1700 Type 6 COM Express Module. Differentiated from ‘commodity’ COM Express modules by its high performance, extreme durability and low lifetime cost of ownership, it features the latest R-Series System-on-Chip (SoC) from AMD, providing it with not only superior throughput but also extensive graphics capabilities.

The launch of the bCOM6-L1700 further expands GE’s growing range of rugged COM Express solutions, providing customers with a broad selection of price/performance options. The bCOM6-L1700 itself is available in two performance/watt variations, and is the first of its type to offer up to 16 GBytes of soldered memory.

Its inherently rugged design and construction make the bCOM-6-L1700  ideal for deployment in challenging harsh environments - that are subject to extremes of temperature, vibration and shock - in which maximum uptime is mission-critical such as heavy industry, transportation, military/aerospace, energy exploration and so on.

Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. Sophisticated dynamic thermal management optimizes uptime and helps prevent damage to the system.

A further differentiator for GE’s COM Express range is GE’s ability to provide customers with the support necessary to enable them to develop their own carrier card configurations, or to provide custom carrier card variants on request. This ability provides significant flexibility to systems integrators looking to create unique, high value-added solutions while reducing cost, risk and time-to-market.

“The COM Express architecture is rapidly gaining traction because, by separating the carrier card from the processor, it extends the useful life of the subsystem by allowing simple, cost-effective upgrade of the processor alone,” said Tommy Swigart, Product Manager at GE’s Intelligent Platforms business. “This reduces long term cost of ownership while ensuring that performance keeps pace with changing needs.”

“Historically, however, COM Express has not been considered for deployment in the most physically challenging environments because sufficiently rugged implementations were not available,” continued Swigart. “The bCOM6-L1700 changes that, bringing not only high performance but also the ability to operate successfully in almost any location.”

“We are elated that GE has once again turned to AMD Embedded Solutions to power their high performance COM Express platform targeting ruggedized Industrial, conventional military and aerospace applications,” said Sameer Gupta, Marketing Manager, Industrial Controls and Automation, AMD Embedded Solutions. “ The modular design, based on open standards, is ideally suited for next generation Industrial PCs, and will provide a path for automation controller system solution providers to scale in design based on AMD technology in those demanding environments.”

As well as supporting up to 16 GBytes of memory, the bCOM6-L1700 supports four SATA interfaces, a Gigabit Ethernet port, eight USB 2.0 and four USB 3.0 ports and either eight GPIO ports or an SD Card interface.

For more information: http://www.geautomation.com/products/bcom6-l1700-rugged-com-express-module

About GE’s Intelligent Platforms business

GE’s Intelligent Platforms business (NYSE: GE) is headquartered in Charlottesville, VA and part of GE Energy Management. The company’s work in the military/aerospace segment, headquartered in Huntsville, AL, and Towcester, England, provides one of the industry’s broadest ranges of high performance, rugged, SWaP-optimized embedded computing platforms. Backed by programs that provide  responsive customer support and minimize long term cost of ownership for multi-year programs, GE’s solutions are designed to help customers minimize program risk and cost, and to speed time-to-market. For more information, visit defense.ge-ip.com.

For more information, contact:

Ian McMurray

Media Relations Manager

GE Intelligent Platforms

Tove Valley Business Park



England NN12 6PF

Telephone:  +44 (0)1327 322821

Email: ian.mcmurray@ge.com

Web:  www.defense.ge-ip.com

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