Triple Stacked BGA Socket tests processor, memory, and memory probe.

Press Release Summary:

Model CBT-BGA-7007 features 0.5 mm pitch stamped spring pins with 26 g actuation force/ball, and 0.4 mm pitch etched spring pins with 34 g actuation force/ball, both which have cycle life of 500,000 insertions. Socket also features floating guide for precise ball-to-pin alignment. Operating in temperatures from -55 to +180°C, it is designed to test 12 x 12 mm, 0.4 mm BGA package in bottom socket and 12 x 12 mm, 0.5 mm pitch memory BGA in top socket. Unit mounts to PCB without soldering.

Original Press Release:

Triple Stacked Spring Pin Socket for Processor, Memory and Memory Probe

Socket your STATSChipPAC fcBGA 520LD PoP Processor with 168BGA Memory and Memory Probe using Extreme Temperature Socket with Superior Electrical Performance

BURNSVILLE, MN - Ironwood Electronics recently introduced a new triple stacked BGA socket addressing high performance requirements for testing processor and memory simultaneously along with a memory probe- CBT-BGA-7007. Two different spring pin technologies were utilized in designing CBT-BGA-7007 - 0.5mm pitch stamped spring pins and 0.4mm pitch etched spring pins. The 0.5mm stamped spring pin has 26 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, capacitance 0.097pF and the current capacity is 4 amps at 80C temperature rise. The stamped spring pins are used in between memory and memory probe as well as between memory probe and processor top.

The 0.4mm stamped spring pin has 34 gram actuation force per ball and cycle life of 500,000 insertions. The loop inductance of the contactor is 0.9 nH, insertion loss < 1 dB at 9.1 GHz, capacitance 0.06pF and the current capacity is 4 amps at 60C temperature rise. The etched spring pins are used in between processor bottom and target PCB. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment.

The specific configuration of the package to be tested in the CBT-BGA-7007 is a processor BGA, 12x12mm, 0.4mm pitch, 520 position, 29x29 ball array in the bottom socket and a memory BGA, 12x12mm, 0.5mm pitch, 168 position, 23x23 ball array in the top socket. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses the smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning.

To use, place known good memory IC into the floating nest assembly and mount to the socket lid using the supplied hardware. Place the supporting back plate on the back side of target PCB. Drop the processor interposer assembly using alignment pins from back plate and place the BGA processor into the cavity. Attach socket body to top of the memory probe and attach probe interposer assembly to the bottom of memory probe. Connect the memory probe assembly to processor interposer assembly using supplied hardware and lock the socket lid assembly on to the socket body using the latch. By turning the compression knob screw, all three stacked interconnections are compressed and the system is ready for testing. This socket can be used for development projects that require understanding of signal interactions between processor and memory with the most stringent environmental requirements.

Pricing for the CBT-BGA-7007 is $2050 at qty 1 with reduced pricing available depending on quantity required.

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