Toshiba America Electronic Components to Showcase Advanced Technologies at CES 2008


Jan. 3

Solid-State Drives, Removable NAND Flash Memory Products and Direct Methanol Fuel Cells to be Featured

Toshiba America Electronic Components, Inc. (TAEC), will showcase new products and demonstrate emerging technologies at the 2008 International Consumer Electronics Show (CES®) in Las Vegas, January 7-10, 2008.

Memory Products: (TM)TAEC will feature a new family of solid-state drives (SSDs) for mobile computing offered in capacities of 32 gigabytes(1) (GB), 64GB and 128GB, and three form factors: an embedded module, and 1.8-inch and 2.5-inch drive enclosures. SSDs realize improved performance, faster boot time, higher reliability, lower power consumption and no mechanical sound compared to hard disk drives, but until now, low densities and high prices have held market penetration back. Toshiba's new SSDs integrate an original MLC controller that supports fast read-write speed, parallel data transfer, and wear-leveling, and achieves performance levels comparable to those of single-level cell NAND-flash-based SSDs. At CES, TAEC will also feature high-capacity, high-speed memory cards including SD, microSD, and SDHC up to 32GB, along with Toshiba TransMemory(TM) USB Flash drives in capacities up to 32GB.

Where: TAEC's SSDs and removable storage products will be displayed in Toshiba booth #12832, in the Las Vegas Convention Center, Central Hall 4. Private meetings to discuss Toshiba SSD and embedded NAND solutions can be arranged by contacting Carol Bardia, MultiPath Communications, carol@multipathcom.com, 949-481-5867.

System LSI Group: TAEC will be holding private customer demonstrations, by appointment only, of its new digital TV/multimedia ICs and turnkey reference platforms as well as the business unit's latest additions to its line of semiconductor solutions for the automotive market, including dashboard display controllers and audio ICs.

Where: Private press interviews to discuss Toshiba digital TV solutions or semiconductor solutions for the automotive market can be arranged by contacting Bob Nelson, Tsantes Consulting Group, bnelson@tsantes.com, 408-201-2402.

Direct Methanol Fuel Cells - Toshiba continues to be at the forefront of developing direct methanol fuel cells (DMFC) for portable consumer electronic applications. At CES 2008, Toshiba will show technology demonstrations including a Gigabeat portable media player with built-in DMFC and a DMFC charger for portable electronics and mobile phones.

Where: Toshiba Booth #12832, Central Hall 4

For press releases on the memory and SLG products, please visit our website, chips.toshiba.com, or virtual press kit, (http://www.virtualpressoffice.com/kit/taec). Some announcements and background materials are available now; others will be added on January 7, 2008.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fourth largest semiconductor manufacturer (iSuppli, World's Top Semiconductor Supplier Rankings in 2006). For additional company and product information, please visit http://www.toshiba.com/taec/.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com/, or from your TAEC representative.

Reader inquiries please publish: Tech.Questions@taec.toshiba.com. CORP 08 503

(1) When used herein in relation to memory density, gigabyte and/or GB means 1,024x1,024x1,024 = 1,073,741,824 bytes. Usable capacity may be less. For details, please refer to specifications.

AGENCY CONTACT:
Jan Johnson
MultiPath Communications
Tel.: (714) 633-4008
jan@multipathcom.com

COMPANY CONTACT:
Deborah Chalmers
Toshiba America Electronic Components, Inc.
Tel.: (408) 526-2454
deborah.chalmers@taec.toshiba.com
Reader Inquiries: Tech.Questions@taec.toshiba.com

Source: Toshiba America Electronic Components, Inc.

Web site: http://www.toshiba.com/taec

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