EP36AO: Flexible Epoxy for Potting and Encapsulation Applications
B-staged epoxy, EP36AO, features outstanding thermal shock resistance and thermal conductivity over the wide temperature range of -100°F to +500°F. It is available for use in 30 gram cookies. EP36AO has excellent adhesion to both metallic and non-metallic substrates, plus a high degree of chemical resistance. It also offers exceptional electrical insulation properties.
For more information, request a technical data sheet on EP36AO: http://click.skem1.com/click/i5pn8-beww0f-13mg5468/
Supreme 18TC: Thermally Conductive Epoxy Meets NASA Low Outgassing Specifications
Supreme 18TC is a one component conductive epoxy adhesive featuring the unmatched heat transfer capabilities. This thermally conductive and electrically insulative system is capable of being applied in thin bond lines (10-15 microns) and meets NASA low outgassing specifications. It has a smooth paste consistency and cures quickly with the addition of heat. Some other positives include low shrinkage upon curing, a low CTE and a high degree of dimensional stability. It bonds well to a wide variety of substrates including metals, composites, ceramics and most plastics.
For more information, request a technical data sheet on Supreme 18TC: http://click.skem1.com/click/i5pn8-beww0h-13mg5460/
EP30TC: Low Thermal Resistance, Room Temperature Curing Epoxy
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and can applied in sections as thin as 5-15 microns, resulting in a low thermal resistance of 7-10 x 10-6 K•m2/W. This NASA low outgassing certified system can be used for bonding, coating, sealing and encapsulating for the aerospace, electronic, optical and OEM industries.
For more information, request a technical data sheet on EP30TC: http://click.skem1.com/click/i5pn8-beww0j-13mg5462/
EP21TDCS-LO: Two Part Silver Filled, Room Temperature Curing Epoxy
With exceptionally low volume resistivity of less than 10-3 ohm-cm, EP21TDCS-LO delivers outstanding electrical conductivity. It also features excellent thermal conductivity of 15-16 BTU•in/ft2•hr•°F [2.16-2.31 W/(m•K)]. This two component compound cures at room temperature and has a convenient one to one mix ratio by weight or volume. EP21TDCS-LO passes ASTM E595 requirements for NASA low outgassing and is serviceable over the temperature range of 4K to +275°F [4K to +135°C]. It has high toughness and impressive peel strength.
For more information, request a technical data sheet on EP21TDCS-LO: http://click.skem1.com/click/i5pn8-beww0l-13mg5464/
MasterSil 972TC-LO: Thermally Conductive/Electrically Insulative, Low Outgassing Silicone
MasterSil 972TC-LO is capable of transferring heat while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubber and plastics. This system has very good flexibility and high elongation. It can withstand aggressive thermal cycling as well as thermal and mechanical shock. MasterSil 972TC-LO is 100% solid and has a white color.
For more information, request a technical data sheet on MasterSil 972TC-LO: http://click.skem1.com/click/i5pn8-beww0n-13mg5466/
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