TMS-5000 Thermal Measurement System can be controlled with USB.
Press Release Summary:
Available in TTV-410X, the TMM-100 variants, TMS-5000 Thermal Measurement System comes with software program for controlling of diode calibration, automated measurement, temperature sensing and data logging. TTV-410X Thermal Test Vehicle is designed in two sizes of Thermal Test Chip mounted on backing plate heat spreader plate and heat sink. TMM-100 Thermal Measurement Module can read up to 8 temperature sensing diodes, 2 thermistors and 2 thermocouples.
Original Press Release:
TEA Introduces the TMS-5000
New Tim Test Solution Integrates TEA Products
Thermal Engineering Associates announces the TMS-5000, a new thermal measurement system for evaluating and testing Thermal Interface Materials (TIM).
Included in the TMS-5000 are the TTV-410X, the TMM-100, a USB controlled power supply and the software to control the system components. The TTV-410X is a Thermal Test Vehicle (TTV) offered with two different sizes of Thermal Test Chip (TTC) which are mounted on a Thermal Test Board (TTB). The TTB includes a backing plate, heat spreader plate, heat sink and integrated cooling fan with power supply, and an edge connector for I/O.
The TMM-100 is a Thermal Measurement Module with the capability to read 8 temperature sensing diodes, 2 thermistors, and two thermocouples. This module is driven through a USB connection for data collection.
Included with the TMS-5000 is a software program which runs in the Windows environment for control of temperature sensing, diode calibration, automated measurement, and data logging.
The measurement capabilities of the TMS-5000 are nicely integrated and easily learned and displayed in the Windows environment. For more information about this new TIM measurement system, contact TEA at sales@thermengr.net for a TMS-5000 data sheet.
SEE THERMAL ENGINEERING ASSOCIATES IN BOOTH 501 AT SEMI-THERM 33 ON MARCH 14 AND 15 AT DOUBLE TREE HOTEL, SAN JOSE, CA.
About Thermal Engineering Associates:
TEA's president, Bernie Siegal, has been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principal author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA equipment and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field. http://www.thermengr.net
SOURCE Thermal Engineering Associates
Web Site: http://www.thermengr.net
