Press Release Summary:
Made without cadmium for favorable environmental profile, DuPont(TM) SolametÂ® PV159 is used as basis for materials characterized by varying degrees of chemical reactivity. This enables solar cell manufacturers to match material to specific process conditions for frontside photovoltaic (PV) solar cell metallization.
Original Press Release:
DuPont Microcircuit Materials Introduces New Solamet® PV159 for Photovoltaic Solar Cells
New Generation Frontside Metallization Material Delivers up to 0.5% More Efficiency for PV Cells
BRISTOL, U.K., Aug 1, 2008 - DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced the introduction of DuPont(TM) Solamet® PV159 thick-film metallization paste for frontside photovoltaic (PV) solar cell metallization. This new, advanced material has outperformed competitive metallization pastes in a wide range of processes, and in trials by customers around the world. DuPont will feature new Solamet® PV159 thick-film metallization paste as part of its broad and growing portfolio of photovoltaic solutions in hall 3, stand A13 at the 23rd European Photovoltaic Solar Energy Exhibition held at the Feria Valencia in Valencia, Spain, from September 1 - 4, 2008.
"DuPont(TM) Solamet® metallization materials, developed by our world class research team, have set the PV industry standard for many years by enabling customers to reduce costs, increase efficiency and enhance the competitiveness of their products," said Peter Brenner, Photovoltaics Business Manager - DuPont Microcircuit Materials. "With the introduction of Solamet® PV159, DuPont has again raised the bar for frontside PV cell metallization, and we're continuing to maximize performance improvements at each account."
Customers who have sampled Solamet® PV159 have seen up to 0.5% efficiency improvement on wafers with shallower emitters compared to standard wafers, with substantial improvements also shown on many other wafer/emitter types. Solamet® PV159 also has a more favorable environmental profile, as it is made without cadmium as an ingredient. Due to these and other advantages, the newly developed chemistry in Solamet® PV159 is being used as the basis for a range of materials characterized by varying degrees of chemical reactivity, enabling solar cell manufacturers to more exactly match the material to their specific process conditions.
DuPont(TM) Solamet® PV159 is compatible with the most recently released Silver Tabbing material, Solamet® PV505, which has become the material of choice for many global manufacturers as a cost effective metallization paste that delivers high adhesion, low laydown and low contact resistance. DuPont(TM) Solamet® PV159 and PV505 metallization pastes are currently available for sampling.
For more information on DuPont Microcircuit Materials and Solamet® metallization pastes, please visit mcm.dupont.com.
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film compositions for a wide variety of electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military, and telecommunications markets. Microcircuit Materials is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for hybrid, rigid and flexible circuits, and materials for advanced displays.
DuPont MCM is also part of DuPont Photovoltaic Solutions (DPVS), which leverages DuPont science from across the company on a global scale to help support the dramatic growth in the PV industry with its comprehensive portfolio of innovative materials and services.
DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.
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Contact: Ellen Pressley