Thermoplastic Temporary Mounting Adhesive withstands high heat.

Press Release Summary:




Available in 7 ½ x 1 ¼ x 5/8 in. bars, Crystalbond™ 590 offers thermal and mechanical stability and is used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations. Application is accomplished by preheating mounting plate to 300°F, melting and spreading adhesive in uniform layer, positioning part, and allowing assembly to cool. After machining, Crystalbond is dissolved in ultrasonic bath using isopropyl alcohol.



Original Press Release:



Crystalbond 590 Mounting Adhesive Now Available



Valley Cottage, NY



SUMMARY

Crystalbond™ 590, a high strength, thermoplastic, temporary mounting adhesive produced by Aremco Products, Inc., is now used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations.



FEATURES

Aremco's Crystalbond™ 590 is an advanced thermoplastic adhesive that provides exceptional thermal and mechanical stability, important requirements for machining operations that produce severe heat, vibration and peel stresses.



The application of Crystalbond™ 590 is easily accomplished by preheating a mounting plate to 300 °F, melting and spreading the adhesive in a uniform layer, then positioning the part and allowing the entire assembly to cool. After machining, Crystalbondtm is dissolved easily in an ultrasonic bath using isopropyl alcohol or Aremco's proprietary 590-S Stripper.



Crystalbond™ 590 can be used for numerous mounting applications such as dicing dense advanced ceramics such as boron and silicon carbide; dicing semiconductors and single crystals; and lapping and polishing optical components.



Crystalbond™ 590 is available in a convenient to use bar form which is 5/8" x 1-1/4" x 7-1/2". Please contact Aremco’s Technical Sales Department for more information about this new advanced adhesive.

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