Thermoplastic Adhesive suits temporary mounting applications.
Press Release Summary:
Bonding to ceramics, glasses, and metals, Crystalbond(TM) 555 flows at 120°F and can be dissolved in hot water. Ethoxylated nonyl phenol-based adhesive is transparent in thin cross-sections, enabling user to observe part during processing. Product is suited for filling gaps and grooves in components requiring temporary mechanical support to prevent breakout during machining. Applications include mounting ceramic substrates, semiconductors, and optical crystals for dicing, grinding, and polishing.
Original Press Release:
Crystalbond(TM) 555 Temporary Mounting Adhesive Now Available
SUMMARY
Crystalbond(TM) 555, a new low melting point thermoplastic adhesive manufactured by Aremco Products, Inc., is now used for mounting ceramic substrates, semiconductors and optical crystals for dicing, grinding and polishing operations.
FEATURES
Aremco's Crystalbond(TM) 555 is an ethoxylated nonyl phenol based adhesive that bonds readily to ceramics, glasses and metals. Crystalbond(TM) 555 flows at 120 oF and can be dissolved readily in hot water. It is also transparent in thin cross-sections, enabling the user to observe the part during processing.
Crystalbond(TM) 555 is optimal for use in low shear machining processes and for filling gaps and grooves in components requiring temporary mechanical support to prevent breakout during machining. Applications, found typically in the electronics industry, include dicing of piezoelectric transducers, microelectronic substrates, ceramic green tape, multi-layer circuit boards, semiconductors, and optical crystals.
Crystalbond(TM) 555 is shipped in a standard ten stick package, 1/2" x 1" x 7" per stick.
Please contact Aremco's Technical Sales Department for more information about this advanced product.
For more information or technical assistance, visit our website, www.aremco.com - technical bulletin A9, or phone us at 845-268-0039.
