Press Release Summary:
With 1:1 mix ratio, flexible 50-1952 cushions electronics from vibration and impact, and is specially formulated for quick thermal transfer away from heat generating electronic devices. Non-corrosive silicone potting and encapsulating compound is made without use of harsh solvents or other toxic materials and is not hazardous to ship. Operating from -65 to +235Â°C, low-exotherm productÂ eliminates need for multiple pours.
Original Press Release:
Thermally Conductive Silicone Easy on Electronics
New Silicone System Quickly Dissipates Heat, is Non-Corrosive, and Vibration Resistant
Epoxies, Etc. offers a new silicone potting and encapsulating compound with a convenient 1:1 mix ratio. The 50-1952 is specially formulated for quick thermal transfer away from heat generating electronic devices. With its high operating temperature range from -65 to +235°C, the 50-1952 provides protection in extreme environmental applications.
The 50-1952 is flexible and therefore protects electronics from vibration and impact. Made without the use of harsh solvents or other toxic materials, this compound is safer to use than other common materials.
• Flexible material cushions electronics
• Thermally conductive, vibration, and reversion resistant
• Low exotherm eliminates the need for multiple pours
• Easy 1:1 mix ratio
• Solvent free
• Not hazardous to ship
Samples are available and may be requested from our website: www.epoxies.com
Thank you for considering the release of the 50-1952 Potting and Encapsulating Compound as a News Release in your publication. All inquiries will be handled promptly and professionally.