Press Release Summary:
Suited for bonding applications, Aremco-Bond(TM) 860 aluminum nitride-filled, electrically insulating epoxy adheres to high-temperature plastics as well as glass, ceramic, and high-expansion metals. This 2-component, 100% solids material has 1:1 resin to activator mix ratio and cures in 24 hr at room temperature or 2 hr at 200Â°F. After curing, it exhibits thermal conductivity of 8.5 Btu-in/hr-ftÂ²-Â°F and dielectric strength of 250 V/mil. Tensile shear strength is 1,375 psi.
Original Press Release:
Aremco-Bond 860 Hi-Temp Thermally Conductive Epoxy Now Available
Valley Cottage, NY - May 17, 2006
Aremco-Bond(TM) 860, a new high temperature, aluminum nitride filled, thermally conductive, electrically insulating epoxy system developed by Aremco Products, Inc., is now used in bonding applications to 400 °F (204 °C).
Aremco-Bond(TM) 860 is a two-component, 100% solids, aluminum nitride filled, thermally conductive epoxy, that is ideal for bonding, potting and tooling applications to 400 °F (204 °C). Aremco-Bond(TM) 860 exhibits excellent adhesion to a variety of high temperature plastics such as polyimides and composites, as well as glass, ceramic, and high expansion metals.
Aremco-Bond(TM) 860 is mixed in a ratio of 1 part resin to 1 part activator by weight and cures in 24 hours at room temperature or in 2 hours at 200 °F. After curing, it exhibits a thermal conductivity of 8.5 Btu-in/hr-ft²-°F and dielectric strength of 250 volts/mil. The tensile shear strength is 1,375 psi. This system also demonstrates very good corrosion protection.
Typical applications for Aremco-Bond tm 860 include the bonding of heat sinks and fins used in heat exchangers and electrical/electronic assemblies. Aremco-Bond tm 860 is supplied in pre-measured pint, quart, gallon and five gallon containers from stock.
Please contact Aremco's Technical Sales Department for more information about this advanced thermally conductive product.