Press Release Summary:
Mixed in ratio of 1 part base resin to 1 part activator by weight, Aremco-Bond™ 860 exhibits optimal adhesion to high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals. Aluminum nitride filled epoxy curesÂ in 24 hr at room temperature or in 2 hrÂ at 200Â°F. After curing, product exhibits thermal conductivity of 8.5 Btu-in./hr-ftÂ²-Â°F and dielectric strength of 250 V/mil. Epoxy isÂ intended for electrical and electronic bondingÂ applications.
Original Press Release:
AREMCO-BOND 860 Thermally Conductive Epoxy Now AvailableValley Cottage, NY –
Aremco-Bond™ 860, a new high temperature, aluminum nitride filled, thermally conductive, electrically insulating epoxy system developed by Aremco Products, Inc., is now used for electrical and electronic bonding applications to 400°F (204°C).
Aremco-Bond™ 860 is a two-component, 100% solids, aluminum nitride filled, thermally conductive epoxy, that is ideal for bonding and small encapsulation applications to 400°F (204°C). Aremco-Bond™ 860 exhibits excellent adhesion to a variety of high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals.
Aremco-Bond™ 860 is mixed in a ratio of 1 part base resin to 1 part activator by weight and cures in 24 hours at room temperature or in 2 hours at 200°F. After curing, it exhibits a thermal conductivity of 8.5 Btu-in/hr-ft2-°F and dielectric strength of 250 volts/mil. The tensile shear strength is 1,375 psi. This system also demonstrates very good corrosion protection and thermal shock resistance.
Typical applications for Aremco-Bond™ 860 include the bonding of heat sinks and fins used in heat exchangers and electrical/electronic assemblies. Aremco-Bond™ 860 is supplied in pre-measured pint, quart, gallon and five gallon kits from stock.
Please contact Aremco’s Technical Sales Department for more information about this advanced thermally conductive product.