Thermally Conductive Adhesive features 1:1 mix ratio.
Press Release Summary:
Two-component, electrically-isolating, EP21AO epoxy adhesive will adhere to similar and dissimilar substrates. Self-leveling paste is 100% reactive and does not contain solvents or volatiles. It has thermal conductivity of 10 BTU/in./ft²/hr/°F and dielectric strength greater than 400 V/mil. Available in pt, qt, gal, and 5-gal kits, product features Shore D hardness greater than 85, tensile strength of 5,000 psi, and operating temperature of -60 to +250°F.Original Press Release:
Thermal Conductive Adhesive has Convenient One to One Mix Ratio
HACKENSACK, NJ - Feb 2, 2004 -- Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance.
EP21AO is easy to apply and is a self leveling paste. It is 100% reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil. Its volume resistivity is >10¹³ ohm cm. EP21AO has a Shore D hardness of >85 and a tensile strength of 5,000psi. Service operating temperature range is -60°F to +250°F.
Master Bond EP21AO is available for use in pint, quart, gallon and 5 gallon container kits.
CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132
MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com
