Thermal Encapsulant is intended for electronic power devices.
Press Release Summary:
Combined with pre-qualified, turnkey dispensing process, DOW CORNING® SE 4451 is designed to meet heat-management needs of electronic power devices. It exhibits thermal conductivity of 3W/mk @ 25°C and viscosity of 32,000 cps, which facilitate dispense and cure times.
Original Press Release:
Dow Corning Introduces New Thermal Encapsulant for Electronic Power Devices
Equipment Alliance Member Helps Develop Turnkey Dispensing Process
MIDLAND, Mich., Nov. 9 -- Dow Corning Corporation today introduced a new thermally conductive encapsulant, DOW CORNING(R) SE 4451, with a pre-qualified, turnkey dispensing process. The combined material-and- process offering is one of the first developments to emerge from the External Equipment Provider Alliance launched by Dow Corning earlier this year.
Designed for the stringent heat-management needs in electronic power devices, DOW CORNING SE 4451 thermally conductive encapsulant offers a unique combination of high thermal conductivity (3W/mK at 25 degrees C) and low viscosity (32,000 cPs). The material's properties enable fast dispense and cure times, thereby reducing costs in volume manufacturing. Dow Corning worked with alliance member Liquid Control Corp., a leading provider of dispensing equipment, to develop a turnkey dispensing process for the new encapsulant.
"Dow Corning understands that materials excellence is only part of the equation in helping our customers succeed. The adoption of any new material must be as smooth and seamless as possible," said Tom Cook, global industry executive director, Dow Corning. "This is why we work with companies throughout the equipment alliance. By streamlining the integration of new materials with process equipment, we're helping our customers increase their productivity, lower production costs and ultimately reach their top-line business goals faster."
SE 4451 further expands Dow Corning's family of thermal interface materials for the electronics industry. The company offers a broad line of thermal materials, including fabricated pads and films, wet-dispensed greases, gels and encapsulants, and materials that combine both fabricated and wet-dispensed properties, such as Dow Corning's recently introduced dispensable pads.
Dow Corning's External Equipment Provider Alliance was officially launched in February 2004. Through the alliance, Dow Corning leverages member companies' expertise to simplify the procurement, integration, start-up and optimization of materials and processing equipment for customers. The alliance comprises nine leading companies from the meter-mix, conformal coating, fluid delivery, rapid curing, stencil printing and robotic XYZ equipment sectors.
Dow Corning and Liquid Control Corp. will discuss SE 4451 and the turnkey dispensing process at an upcoming online seminar on thermal interface materials. Hosted by Dow Corning, the one-hour seminar will be held on November 11, 2004 at 11 a.m. EST. To learn more or to attend, go to: https://dowcorning.webex.com/dowcorning/onstage/g.php?d+751415399&t=a
About Liquid Control
Based in North Canton, Ohio, Liquid Control is The Knowledge Leader in Dispensing Equipment, designing and manufacturing a complete line of precision meter, mix and dispense equipment for single- and multiple-component materials. Its other operating units include Decker Industries, specializing in polyurethane processing equipment and continuous dispensing applications using rotary pumps; Profill Corp., which provides contract resin dispensing and repackaging services; and Liquid Control Limited in England, offering a complete range of dispensing equipment and services for the European market. For more information, call 330-494-1313 or visit www.liquidcontrol.com/ .
About Dow Corning
Dow Corning Corporation (http://dowcorning.com/electronics) is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technology for all segments of the electronics industry. Dow Corning has development and applications centers strategically located throughout Asia, Europe and the United States. The centers offer advanced resources for electronics materials and services, and are staffed with experienced professionals who can provide technical support to customers locally. Dow Corning Corporation is equally owned by The Dow Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW) . More than half of Dow Corning Corporation's sales are outside the United States.
CONTACT: Don Piering of Dow Corning, +1-989-496-8972, or don.piering@dowcorning.com
