Test Socket tests devices from 14 to 27 mm² wide.

Press Release Summary:



RF Center Probe Test Socket provides manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1-10 GHz. Four-point spring probe crown ensures scrub on solder ball oxides. With signal path of .077 in., socket provides minimal signal loss. Solderless, pressure-mount, compression spring probes are accurately located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Operating temperature is -67 to 302°F.



Original Press Release:



New RF Center Probe Test Socket for Devices from 14 to 27 mm2 Now Available from Aries



Frenchtown, NJ, October 2003 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a new high frequency test socket for devices from 14 to 27 mm² wide. The new socket is ideal for manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 10 GHz, such as CSP, MicroBGA, MLF, QFN, DSP, LGA, SRAM, DRAM, and Flash devices.

A 4-point spring probe crown on the new socket ensures "scrub" on solder ball oxides for reliable contact mating. For MLF and QFN packages, the socket also incorporates a raised point probe for accurate placement and scrub on small pads. With a signal path of only .077" (1.95 mm), the new RF socket provides minimal signal loss for higher bandwidth capability.

The new socket's solderless, pressure-mount compression spring probes are accurately located by two molded plastic alignment pins and secured with four stainless steel screws to ensure fast, easy access for mounting to and removal from the load board. In addition, the socket's small overall size provides the maximum allowable space for load board components and connectors.

Estimated contact life is over 500,000 cycles. Center probe contact forces are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. The new RF test socket's operating temperature is -55°C to 150°C (-67°F to 302°F).

The compression spring probes are heat-treated beryllium copper alloy, plated with 30 µ" min. (0.75 µm) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per QQ-N-290. The socket's molded components are UL94V-0 PEEK and/or Ultem and machined socket components are UL94V-0 Ultem or Torlon. All hardware is stainless steel.

As with all Aries sockets, the new RF test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing for a 200-lead RF Center Probe socket for 3.5 GHz applications starts at $500 each for up to four pieces. Delivery is 2 weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com; Web: www.arieselec.com, Data sheet #24099-www.arieselec.com/products/24009.pdf.

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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