Tensorcom, Inc. Announces Lowest Power 802.11ad Complete Solution
Blazing fast 2.5 Gb/s data rate, using less than 150 mW peak power in a small form factor is the best solution for mobile devices
CARLSBAD, Calif. — Tensorcom has announced availability of the lowest power, 802.11ad/WiGig compliant System in a Package (SiP), which includes an industry leading "Green" System on a Chip (GSoC™) that implements the MAC and PHY as well as multiple 60 GHz antennas. The TC2522-Y is the first GSoC™ to meet the power and size requirements of mobile phones and tablets while providing > 2.5 Gb/s throughput. The TC2522-Y showcases Tensorcom's industry leading 60 GHz radio design as well a novel MODEM and MAC implementation that delivers on the 802.11ad promise of low-power Gb/s data connectivity for mobile platforms. The Tensorcom's TC2522-Y is designed for IEEE Std 802.11ad-2012™ and supports up to 2.5 Gb/s operation over all four 60 GHz channels. It has been designed to be the lowest cost, lowest power solution for integrating multi-gigabit wireless links in space and power constrained devices such as mobile phones and tablets.
Tensorcom will be demonstrating its GSoC™ solution in Mobile World Congress in Barcelona, February 24 - 27.
"This solution changes the entire landscape of mobile connectivity and provides new opportunities for a consolidation of computing platforms," said Hock Law, CEO of Tensorcom. "We are able to provide a 10x increase in data rate with a fraction of the power. In addition, the implementation of the ultra-low power mode utilizes 150 mW peak power while still supporting 2.5 Gb/s."
"Tensorcom's dream of providing an ultra-low power 60 GHz solution in the mobile space has now become reality and we look forward to OEM's adopting Tensorcom's solution in a variety of mobile applications," said Dr. Ismail Lakkis, Co-founder of Tensorcom.
"Tensorcom is the leader in ultra high-speed, very low-power, millimeter-wave solutions. The design team has created a standards compliant solution that will enable new applications for mobile devices," said Dr. Behzad Razavi, Professor of Electrical Engineering at UCLA, and technical advisor to Tensorcom.
"I'm thrilled that Tensorcom is a member of the NantWorks family of investee companies. In particular, I am very proud of the achievements of the Tensorcom team as it proceeds with sampling and production of the world's first commercially available ultra low power 802.11ad system on a chip in 2014," said Dr. Patrick Soon-Shiong, Lead Investor and member of the Board of Directors.
Key Features:
-Â Fabricated in TSMC 40 nm standard CMOS process
-Â Peak power < 150 mW using 802.11ad compliant low power single carrier mode
-Â 2.5 Gb/s data rate supports QHD/4K video streaming
-Â Complete solution including antennas fully integrated in a single package
-Â Low cost 17 mm x 11 mm x 0.5 mm module
-Â Available in a novel end-fire antenna pattern suitable for placement in thin devices or with patch antenna for vertical mounting
Availability
Engineering sampling begins in Q2:2014, and production in Q3:2014
About Tensorcom
Tensorcom received its first funding round in October 2010 from California Capital Equity, LLC, an investment arm of Dr. Patrick Soon-Shiong. Subsequently, it has closed 2 additional rounds of funding, and has become the industry leader in single chip low power 60 GHz multi-gigabit connectivity solutions for mobile devices. Tensorcom's leading edge technology and design expertise enables a variety of applications for small form-factor, mobile devices including high speed data synchronization, real time video streaming and high-speed wireless docking. Tensorcom solutions fully support IEEE Std 802.11ad. Using the extensive industry experience of its design team, Tensorcom has jumped into the lead for low power, small form-factor, SiP solutions with multiple options for integrated antenna.
("IEEE", "802" and "IEEE 802.11ad" are trademarks of the Institute of Electrical and Electronics Engineers, Inc.)
For more information on Tensorcom: http://www.tensorcom.com/
SourceÂ
Tensorcom
Contact: Yuan Su, VP, Program Management, +1 760-692-9821, ysu@tensorcom.com; James Gilb, Director Technical Marketing, +1 760-496-3265, jgilb@tensorcom.com
Web Site: http://www.tensorcom.com
