Temporary Mounting Adhesive has low melting point.
Press Release Summary:
Suited for mounting ceramic substrates, semiconductors, and optical crystals for dicing, grinding, and polishing operations, Crystalbond(TM) 555 thermoplastic adhesive bonds to ceramics, glasses, and metals. Ethoxylated nonyl phenol-based adhesive, which flows at 120°F and can be dissolved readily in hot water, is transparent in thin cross-sections and consequently lets user observe part during processing. Adhesive comes in 10-stick package, and each stick measures ½ x 1 x 7 in.
Original Press Release:
Crystalbond 555 Temporary Mounting Adhesive Now Available
SUMMARY
Crystalbond(TM) 555, a new low melting point thermoplastic adhesive manufactured by Aremco Products, Inc., is now used for mounting ceramic substrates, semiconductors and optical crystals for dicing, grinding and polishing operations.
FEATURES
Aremco's Crystalbond(TM) 555 is an ethoxylated nonyl phenol based adhesive that bonds readily to ceramics, glasses and metals. Crystalbondtm 555 flows at 120 °F and can be dissolved readily in hot water. It is also transparent in thin cross-sections, enabling the user to observe the part during processing.
Crystalbond(TM) 555 is optimal for use in low shear machining processes and for filling gaps and grooves in components requiring temporary mechanical support to prevent breakout during machining. Applications, found typically in the electronics industry, include dicing of piezoelectric transducers, microelectronic substrates, ceramic green tape, multi-layer circuit boards, semiconductors, and optical crystals.
Crystalbond(TM) 555 is shipped in a standard ten stick package, 1/2" x 1" x 7" per stick. Please contact Aremco's Technical Sales Department for more information about this advanced product.
