TE Connectivity Demonstrates 400G Connector and Cable Assembly Solutions at OFC 2019

High-Speed Solutions Enhance the Latest Datacenter Equipment Designs

HARRISBURG, Pa., Feb. 26, 2019 /PRNewswire/ -- TE Connectivity (TE), a world leader in connectivity and sensors, will showcase a comprehensive lineup of high-performance connectors, sockets, cable assemblies and power solutions at the OFC 2019 conference held in San Diego on March 3-7. TE will show its innovative solutions in the Ethernet Alliance booth (#4749), the OIF (Optical Internetworking Forum) booth (#6215) and the COBO (Consortium for On-Board Optics) booth (#1817) throughout the show. TE experts will be on site at each location, ready to engage in technical conversations to explain how TE products enable high-speed connectivity for next-generation applications.

During OFC, TE products are showcased in the 100G and 400G active demonstrations in the Ethernet Alliance booth with SFP56, QSFP56, OSFP, QSFP-DD connectors and QSFP-DD-to-OSFP cable assemblies based on signaling at 25G and 50G individual pair signaling rates, along with an operating 800G capable OSFP cable based on 100G individual pair signaling. In the OIF booth, TE will participate in active 100G individual pair signaling demonstrations with an OSFP to QSFP-DD cable assembly, an OSFP connector and cage, and a QSFP-DD connector and cage. The COBO booth will include TE's demonstration of its 100Gbps capable Sliver COBO connector in partnership with Credo.

The following TE products will be featured in these demonstrations and displays:

I/O connectors: SFP56, SFP-DD, QSFP56, OSFP and QSFP-DD 400G interconnects, Nano-Pitch I/O™ connectors (NPIO), and COBO as well as thermally enhanced versions of all these pluggable interconnects. A demonstration of 800G OSFP will be included.

Copper cable assemblies: SFP56, SFP-DD, QSFP56, OSFP, and QSFP-DD direct attach cables, including a demo of 800G OSFP cables. In addition, Sliver cables (SFF-TA_1002, GenZ), and STRADA Whisper cables will be shown.

Board to Board: STRADA Whisper, Z-PACK Slim UHD, Z-PACK HM-eZd+ backplane connectors, and backplane cable assemblies.

Sockets: LGA 3647 (Socket P) and XLA 3800+ position sockets

Power Delivery: Open Compute Power, MULTI-BEAM HD

Internal Interconnects: Sliver Interconnects (SFF-TA-1002, GenZ, EDSFF, OCP NIC 3.0, DDIMM, COBO), Nano-Pitch I/O™ connectors (OCuLink), and STRADA Whisper in an internally cabled system.

"As Ethernet performance advances to 400G and looks beyond, leading organizations like TE are keeping pace with the change," said John D'Ambrosia, chairman of the Ethernet Alliance. "We are delighted to have TE joining us in our operating demo at OFC 19 as we point the way forward in high-speed data for the Next Ethernet Era."

"We appreciate the opportunity to have our products designed into the Ethernet Alliance, OIF and COBO live demos at OFC 19," said Nathan Tracy, technologist at TE Connectivity's data and devices business unit and president of the OIF. "Our membership in these organizations keeps TE aligned with industry directions and enables TE to contribute our world-leading technologies toward solving industry's biggest challenges, whether it's power delivery, higher data rates thermal management or data computing and storage."

About OIF

OIF is where the optical networking industry's interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry's ecosystem and facilitate global connectivity in the open network world. At OFC 2019, OIF member companies are collaborating to lead interactive interoperability demonstrations of solutions that are vital to the global network, including:

  • Common Electrical I/O (CEI)-112G
  • FlexE (Flex Ethernet)
  • 400ZR

These live interoperability demonstrations will be on display March 5-7, 2019 at OFC in San Diego, CA at OIF Booth #6215. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com. Additional information about the OFC demos can be found at https://www.oiforum.com/meetings-and-events/oif-ofc-2019

ABOUT TE CONNECTIVITY 

TE Connectivity Ltd. is a $14 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedInFacebook and Twitter.

CONTACT: Media Relations Contact: Lauren Brekosky, TE Connectivity, 717-986-7342, Lauren.brekosky@te.com

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