Taiwan Foundry Sets Standard for Opaque Film Process Control-Orders New Metapulse-III Systems from Rudolph
Next-generation PULSE tool offers a low cost of ownership and a modular design for cost-effective upgrades
San Francisco, CA (July 11, 2006)-Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader of high-performance process control metrology, defect inspection, and data analysis systems for semiconductor manufacturing, today announced a multiple-unit sale of its recently-launched MetaPULSE-III(TM) Opaque Film Metrology Systems to a leading foundry in Taiwan. Rudolph's patented PULSE Technology(TM) has been adopted as the standard for opaque film process control and chemical mechanical planarization (CMP) dishing and erosion monitoring; the foundry has installed more than ten of the previous-generation MetaPULSE-II systems.
"This sale is an important milestone for us because it validates the concept of the new MetaPULSE-III," said Jana Clerico, Rudolph's opaque film product manager. "The MetaPULSE-III has been value engineered, reducing costs and increasing throughput, to significantly improve the cost of ownership (CoO) without sacrificing metrology capability. In addition, the MetaPULSE-III is more user friendly and the modular design allows customers to easily add metrology capacity as their production ramps. It is especially heartening that this validation comes from a valued customer that is currently using our PULSE Technology for their most advanced process control requirements".
The MetaPULSE-III provides the advanced metrology capabilities of the MetaPULSE-II tool with up to a 35 percent reduction in CoO. The new modular design enables field upgrades to the Turbo model that incorporates two PULSE metrology modules, providing a cost-effective method to double throughput while maintaining a small footprint. Other metrology technologies can also be added to adapt to changing metrology requirements.
Rudolph's PULSE Technology Systems use laser-induced sound waves to measure film thickness and other properties of metals and interlayer dielectrics. MetaPULSE-III includes the new Microsoft® Windows®-based Rudolph Studio(TM) operating software and the EASy(TM) Expert Application System for enhanced usability as well as offering improved pattern recognition for on-product wafer measurements.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com
