Stereolithography Material provides long-term stability.

Press Release Summary:



RenShape® SL 7580 offers ABS-like mechanical properties over extended periods of time. It exhibits rigid flexural modulus of 2,400 MPa and retains high elongation, even after aging for several months. Photopolymer produces opaque white parts that look as if they were injection molded from thermoplastic ABS. Formulated for use on solid-state SLA platforms, RenShape SL 7580 features elongation at break of 11% and heat deflection temperature of 145°F after UV postcure.



Original Press Release:



RenShape SL 7580 Sets New Standards for Long-term Mechanical Stability of SL Materials



EAST LANSING, Mich., November 10, 2003 - A unique, new stereolithography material that provides for outstanding stability of ABS-like mechanical properties over extended periods of time was introduced today by the RenShape® Solutions Group of Huntsman Advanced Materials.

Based on innovative, patent-pending chemistries, RenShape SL 7580 exhibits a high flexural modulus with excellent elongation and retains its high elongation even after ageing for several months. With the new material, customers can build durable, high-accuracy models and patterns with excellent detail resolution and dimensional stability. The same photopolymer is ideal for functional prototyping with the toughness needed for snap-fit closures and the temperature resistance required for equipment housings. SL 7580 parts are particularly easy to clean and finish.

According to Mahesh Kotnis, SL marketing manager, "The market has long demanded SL materials with improved mechanical stability to eliminate the embrittlement that characterizes almost all SL materials available today. As an industry leader in SL materials, we have responded to this need by introducing RenShape SL 7580. The new photopolymer satisfies the long-term durability requirements of customers and it produces opaque white parts that look as if they were injection molded from thermoplastic ABS in a precision-cut production tool."

Formulated for use on solid-state SLA platforms, RenShape SL 7580 features a rigid flexural modulus of 2,400 MPa (350,000 psi) and elongation at break of 11%. Heat deflection temperature of the new product is 63°C (145°F) after UV postcure. After a two-hour 80°C (176°F) thermal postcure, the heat deflection temperature increases to 97°C (207°F).

For more information about RenShape SL 7580 photopolymer and other advanced SL materials supplied by the RenShape Solutions Group of Huntsman, contact: Mahesh Kotnis, Huntsman Advanced Materials, 4917 Dawn Avenue, East Lansing, Michigan 48823, 517-351-5900, email: mahesh_kotnis@huntsman.com, website: www.renshape.com.

In addition to a broad line of SL materials, Huntsman's RenShape Solutions Tooling Group also manufactures and markets machinable modeling and tooling boards as well as epoxy and polyurethane systems for modeling, moldmaking, prototyping and forming initial parts used in the automotive, foundry, aerospace and general manufacturing industries. The company has been a world leader in plastic tooling materials for more than 60 years.

Huntsman Advanced Materials is part of Huntsman's Polyurethanes and Specialties Division. The Advanced Materials group manufactures and supplies materials used in coatings and structural composites, adhesives and electrical/ electronic insulation materials in addition to RenShape Solutions' tooling systems. The combined Huntsman group companies constitute the world's largest privately held chemical company with more than 15,000 employees, facilities in 44 countries and 2002 revenues of greater than $8 billion.

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