SRAM MCM Memories are available in 32 and 40 Mbit versions.

Press Release Summary:



Leveraging 16M/20M Monolithic SRAM, UT8ER1M32 (32 Mbit) and UT8R1M39 (40 Mbit) HiRel SRAM Multi-Chip Module (MCM) memories comprise 6 models using universal 132-lead CQFP (ceramic quad flatpack). Embedded error detection and correction (EDAC) with user programmable auto scrubbing options and 20 nsec access time is standard with UT8ER1M32, and UT8R1M39 accommodates designs using external system EDAC controllers. Memory densities range from 32-128 Mbit and 40-160 Mbit.



Original Press Release:



Aeroflex Announces Production of New 32 and 40Mbit SRAM Multi-Chip Modules (MCM) Memories



COLORADO SPRINGS, CO - Aeroflex Colorado Springs announced production of its UT8ER1M32 (32Mbit) and the UT8R1M39 (40Mbit) HiRel SRAM Multi-Chip Modules (MCM) memories. Leveraging its 16M/20M Monolithic SRAM, Aeroflex created six new SRAM MCMs using a single universal 132 CQFP (ceramic quad flatpack) with the 32Mbit and 40Mbit being its first production products.

The UT8ER1M32 employs embedded EDAC (error detection and correction) with user programmable auto scrubbing options and 20ns access time. For designs using external system EDAC controllers, Aeroflex offers the UT8R1M39 SRAM MCM.

Using a universal 132-lead package which integrates up to eight 16M or 20M memory die, Aeroflex's latest SRAM MCMs allow for increased memory density with limited system impact. Memory densities range from 32Mbit to 128Mbit and 40Mbit to 160Mbit. Aeroflex began designing MCMs in 2004 to provide increased performance, functionality or, in the case of memory, bit density. MCM packaging technology has been used in the avionic and commercial industry for many years and it is an advantageous choice for HiRel applications to reduce board area component count and overall electronic effectiveness.

With 20ns access time and 1.8-volt core voltage, the SRAM MCMs offer low power consumption, fast access time, a Standard Microcircuit Drawing (SMD) procurement vehicle for guaranteed quality, reliability and operating performance. Both products offer 100 krad(Si) total dose operational environment and are Single Event Latchup (SEL) immune to 111Mev-cm2/mg. The 20ns access time of the Aeroflex SRAMs allows for zero wait-state interface to today's leading edge 32-bit microprocessors, simplifying design complexity. It is ideal for data and instruction memory, as well as small instrument and telemetry acquisition systems.

"Aeroflex has been producing HiRel memories for harsh environments for over 25 years," said Anthony Jordan, director-standard products. As a fab-independent supplier, we can design and develop leading-edge products built in state-of-the-art wafer manufacturing facilities."

"Another advantage to our customers is our memory packaging roadmap," said Jordan. "We have taken our customer's needs for various memory sizes (density and organization) and provided them a variety of package options, such as flatpack, MCM, and high-density chip stacking technology. Again, Aeroflex has gone to great lengths to provide solutions and worked side-by-side with customers to solve their packaging problems."

The UT8ER1M32 and UT8R1M39 are QML qualified with procurement through a Standard Microcircuit Drawing. Prototypes and production are available now. The UT8R1M39 is $3,568, QML Q, in lots of 100. The new 64 to 160Mbit SRAM MCMs will be available as prototypes in 1H2011.

Aeroflex Colorado Springs, is a supplier of semicustom and standard VLSI circuits and custom circuit card assemblies. Aeroflex, Colorado Springs has received Qualified Manufacturer List (QML) certification for Class Q, Class T and Class V. Additionally, we have received a letter of compliance for ISO 9001 from the Defense Supply Center Columbus.

For a copy of the Memory Marketing Kit, call 1-800-645-8862, write Aeroflex, 4350 Centennial Blvd., Colorado Springs, CO 80907, or visit our home page at http://www.aeroflex.com/memories.

About Aeroflex
Aeroflex Incorporated is a leading global provider of microelectronic components and test and measurement equipment used by companies in the space, avionics, defense, commercial wireless communications, medical and other markets.

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