Sonics is COOL and HOT at DAC!


MILPITAS, Calif. - Sonics, Inc., the world's foremost supplier of on-chip network (NoC) technologies and services, is participating in the Design Automation Conference (DAC) 2015. The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. Sonics will be showing its cool new ICE-Grain™ Power Architecture and participating in the Heart of Technology (HOT) fund raiser among other activities.



Here's the rundown on where to find Sonics at DAC.



DAC Exhibit Floor



    Dates:                     June 8 - 10



    Location:                 ARM Connected Community, Booth

                                    #2414



                                    Constellations IP Community, Booth

                                    #3501



Visit Sonics in one of these locations to learn why we are the Trusted Leader in On-Chip Networks. We'll be showing demos of SonicsGN® and SonicsStudio® Director. We'll also be talking about the IP industry's first complete power management subsystem solution, our new ICE-Grain Power Architecture.



IP Track: Low Power IP



    Date:                       June 8th, 10:30 am - 11:30am



    Location:                  Room 101



Many of today's SoCs, ASICs, and ASSPs contain multiple digital, analog, and subsystem IPs. In the majority of cases for such ICs, the dynamic power and static power play key roles in the differentiation and viability of complex chips. In this session, implementation techniques, selection tradeoffs, and optimization for ultra-low power IC will be presented. This is greatly beneficial for designers in applications such as: IOT, automotive, imaging, wireless, networking, portable multimedia, medical, gaming, video, and MEM applications.



1.1   Taking Advantage of the Dark Silicon Opportunity

1.2   Low Power IP

1.3   Power Regression Flow for Soft IPs

1.4   Techniques for Power and IR Drop Optimization in Sensor Digital IP



QA Poster Session - Tuesday, June 9th, 4:30 - 6:00pm - Exhibit Floor



IP Track: Minimizing SOC Power Consumption With Power Efficient IPs



    Date:                        June 8th, 11:30 am - 12:00pm



    Location:                  Room 101



In this panel, implementation techniques and tradeoffs for designing ultra Low-power SOCs, ASSPs, and ASICs will be presented. These techniques are critical for battery-powered devices, and other devices that are sensitive to thermal management as well as reduction of packaging cost. IP suppliers and EDA vendors now offer low-power IPs as well as optimization tools.



Topics such as FinFet and FDSOI devices will be compared with planar CMOS, power harvesting, and using UPF for low power implementation. Designers also apply reduced voltage or Dynamic Voltage Frequency Scaling (DVFS), power shutdown, and retention logic. Typical low-power designs could have over 30 different power modes and power domains. Dual-rail memory IPs operate in full power, partial power, or shutoff modes. Designs include isolation cells, level shifters, and retention cells with multiple modules in each power domain.



Optimization of these advance techniques for various applications such as portable Gaming, IOT, Automotive, Wireless, Networking, Portable Multimedia, wearable computing, and low power techniques are paramount for gaining and keeping market share.



ARM Connected Community Pavilion Presentation



    Dates:                    June 8th at 2:45 pm



                                  June 9th at 1:15 pm



    Location:                Booth #2414





IP Talks, ChipEstimate Booth



    Dates:                     June 8th at 4:00 pm



                                   June 9th at 1:30 pm



                                   June 10th at 5:00pm



    Location:                 Booth #2433



Power is on everyone's mind whether you're creating an application processor for mobile phones or an SoC for IoT or Wearable applications. Conventional software-based power management approaches don't save enough power. This presentation will cover the need for a hardware-based power management solution for mainstream SoC designs. It will introduce Sonics' ICE-Grain Power Architecture, which is the semiconductor IP industry's first complete power management subsystem. It will discuss the key capabilities and benefits of the ICE-Grain Power Architecture and explain how the solution makes sophisticated power management and control techniques available to a broader audience.



Heart of Technology (HOT) Fundraiser--Love IP Party



    Date:                        June 8th at 7:00 pm - 11:30 pm



    Location:                  Jillian's at the Metreon



Sonics is sponsoring Heart of Technology's must-attend groovy event. Embodying the spirit of San Francisco's Summer of Love, the Love IP Party is the social celebrates the creative thinkers, the IP revolution, and brotherly love to support the Guardian Scholars Program at San Jose State University. It's going to be far out, man! So get your best flower child outfit together and join us on June 8 at Jillian's SF.



Agile IC Methodology Forum



    Date:                       June 9th at 10:30am - 12:00 pm



    Location:                 Room 306



The old waterfall design methodologies are breaking down. Come learn about Agile IC Methodology - What is it? How it relates to Agile software design? To Shift Left? Hear from designers who have actually used Agile methods in their production projects. This forum will feature presentations with plenty of opportunities for Q&A with each presenter. The two LinkedIn groups discussing this topic have more than 800 members combined - what are you missing? This is your chance to understand and influence the shape of future IC design methodologies.



Stars of IP Party



    Date:                       June 9th at 9:00 pm - 1:00 am



    Location:                 Novela's on Mission



Sonics is sponsoring the Stars of IP Party to celebrate all things semiconductor IP. Together we seek to build relationships among IP provider companies and customers, thereby strengthening the ecosystem.



About Sonics, Inc.



Sonics, Inc. (Milpitas, Calif.) is the trusted global leader in on-chip network (NoC) technologies used by the industry's top semiconductor and electronics product companies. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Our comprehensive NoC portfolio delivers the communication performance required by today's most advanced consumer digital, communications and information technology devices. Sonics' NoCs are integral to the success of SoC design platforms that innovators such as Broadcom®, Intel®, Marvell®, MediaTek, and Microchip® rely on to meet their most demanding SoC integration and time-to-market requirements. We are a catalyst for design methodology change and actively drive industry conversation on the Agile IC LinkedIn group. Sonics' holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com, and follow us on Twitter at twitter.com/sonicsinc.



Contact: Erica Harbison

McClenahan Bruer

erica@mcbru.com | 503-546-1013



Source

Sonics, Inc.



Web Site: http://sonicsinc.com




More from Optics & Photonics

All Topics

COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers