Solid-State Relays optimize process/machine control.

Press Release Summary:



Panel-mount Zelio® SSRP, able to switch up to 125 A, and DIN-mount Zelio SSRD relays with heat sink meet equipment specifications for vibration resistance. Devices are available in AC and DC control versions. They are suited for packaging, food and beverage, plastic extrusion, industrial machines, HVAC, and textile manufacturing applications.



Original Press Release:



New Schneider Electric Zelio® Solid-State Relays Offer Reliable Process, Machine Control



Palatine, Ill. (USA), July 7, 2009 - The Schneider Electric Relay Competency Center (SE Relays LLC) is expanding its Zelio® relay product offer with solid-state relays and accessories to meet equipment specifications for vibration resistance and increased reliability.

The offer comprises two industry-standard formats: the panel-mount (hockey puck-style) Zelio SSRP and the DIN-mount Zelio SSRD. The panel-mount Zelio SSRP version optimizes size and performance, with models able to switch up to 125 amperes, while corresponding accessories streamline the heat-sinking process. DIN-mount Zelio SSRD solid-state relays provide ready-to-go solutions with an integral heat sink. Both models offer AC and DC control versions.

"I am very excited about this new offer as it fills a critical product gap for our distributors and customers, who rely on Schneider Electric to provide complete solutions," said Dipin Jain, Schneider Electric relays product manager. "The new solid-state relay offer maintains Schneider Electric's core values of safety and quality, while providing high performance and long life for critical-demand applications."

Jain said many industries such as packaging, food and beverage, plastic extrusion, industrial machines, HVAC and textile manufacturing desire solid-state switching solutions for reliable and consistent performance.

Schneider Electric employs strict quality control during every aspect of the Zelio solid-state relay production process. Automated robotics used in the printed circuit board assembly provides consistency, while multistage product testing controls quality. Direct copper bonding technology provides excellent electrical insulation and enhances thermal conductivity.

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